A cyanide tin - copper plating process was optimized by means of orthogonal test. The effect of bath components of electrolytic solutions and electrodeposits was investigated.
采用正交试验研究了氰化镀铜锡合金工艺中各因素水平与镀液、镀层性能的关系，优选出一种最佳工艺配方。
A cyanide tin - copper plating process was optimized by means of orthogonal test. The effect of bath components of electrolytic solutions and electrodeposits was investigated.
采用正交试验研究了氰化镀铜锡合金工艺中各因素水平与镀液、镀层性能的关系，优选出一种最佳工艺配方。
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