但失败分析是这样的。
On-line Failure analysis, and improvement testing.
生产不良失效分析及改善测试。
Customer field failure analysis, and technique support.
客户现场失效分析，技术支持。
Field defect returns failure analysis and improvement testing.
现场不良返货失效分析及改进测试。
According to parts 'failure analysis, some modified steps have been presented.
对于其零部件，在失效分析的基础上，提出了改进的措施。
The procedure of the failure analysis and some inspection methods were presented.
给出了失效分析的程序和若干检验方法。
The appropriateness of selection is still bearing failure analysis must be considered.
选材是否得当仍然是轴承失效分析必须考虑的因素。
It also presents failure analysis of the product and reliability characteristic index.
对该产品进行了失效分析，给出了可靠性的特征指标。
The problems of random boundary notches are often occurred in engineering failure analysis.
边界缺口群是工程失效分析时经常遇到的问题。
This failure analysis was performed by using macro check, micrography and hardness measurement.
采用宏观分析、显微检验和硬度测定对压铸模进行了失效分析。
In this paper, the failure analysis of a type of high frequency power transistor is introduced.
介绍了对某型号高频大功率晶体管进行的失效分析。
Failure analysis is made through investigation for an imported floating deck in aluminium alloy.
通过对一座进口铝浮盘损坏情况的调查，对铝浮盘进行了失效分析。
Customer RMA failure analysis and to follow up the 8D report as well as other work assigned by supervisor.
客退品不良分析和8D报告的跟踪。其他的上司安排的内容。
Aimed at the wear problem of roll axle neck, failure analysis and rebuilding were made for multi-roller mill.
针对多辊筒碾压机压辊轴颈磨损严重的问题，对其进行了故障分析和改造。
Lead the failure analysis for products failed in-house production, on customer side and in manufacturing process.
负责内部生产、客户端和制造工艺中的失效产品的故障分析。
The result can provide certain reference value to further fatigue and failure analysis of ocean petroleum pipeline.
结果可对进一步分析海洋石油管线的疲劳可靠性提供一定的理论参考价值。
Through failure analysis, it is confirmed that the roller failure is caused by the insufficient of hardening capacity.
对此进行了失效分析，找出了轧辊失效的原因是淬硬性不足。
The essential failure type and the main consideration for die are described in this paper on side of failure analysis.
此文从失效分析的角度，阐述了模具的基本失效形式及一些主要影响因素。
Support production line to do process failure analysis and product diagnosis. Continuously optimize process and CPK etc.
帮助生产线分析工艺失效原因，提高良品率，改善过程能力。
This article focuses on the automotive power systems common failure analysis, diagnosis and the main content of the maintenance jobs.
本文着重探讨汽车电源系统的常见故障分析、诊断以及维修作业的主要内容。
Perform reliability testing and root cause and failure analysis of complex problems and systems using applicable statistical methods.
执行可靠性测试和根本原因和失效分析复杂问题和系统使用适用的统计方法。
The suitable use of some testing instruments can verify the correctness of the ideas of failure analysis, and develop the ideas also.
恰当地选用各种检测仪器，可以验证失效分析诊断思路的正确性，并能推动分析不断深入。
The present methods can supply the failure analysis of bridge deck pavement layer in concrete highway Bridges with a new way of study.
本文为混凝土公路桥中桥面铺装层的破坏分析提供了一种新的研究途径和方法。
It is determined that main failure mode for failed products is bad contact through failure analysis on products, failed during life test.
通过对寿命试验中失效的产品进行失效分析，判定失效的产品主要的失效模式为接触不良。
Failure analysis is conducted for the single chip packaging process of an advanced high-range MEMS accelerometer with double cantilever beams.
对一种先进的双悬臂梁高量程MEMS加速度计的单芯片封装工艺进行了失效机理分析。
When used in failure analysis of LCD module, it will simplify the analysis process, make the process clearly and increase the analyzing efficiency.
将路经分析应用于液晶显示模组的失效分析，将使失效分析脉络清晰，并简化分析过程，提高分析效率。
It has been proved that these cracks are caused by sulfide stress corrosion cracking (SSCC) through failure analysis and service environment survey.
通过失效分析和管道服役环境调查，证明开裂原因是管道服役期间发生硫化物应力腐蚀开裂(SSCC)。
It is very important for improving drilling rate, reducing drilling cost and safety drilling to carry out drill stem failure analysis and prevention.
开展油田钻柱失效分析与预防对提高钻井速度、降低钻井成本及井下安全钻进具有重要意义。
In this thesis, the application of the failure analysis in MCP package technology will be addressed along with some general fa instrument and methods.
本文将主要讨论现阶段一般的封装失效分析的技术与设备，并且重点研究失效分析技术在多芯片封装领域的应用。
In this thesis, the application of the failure analysis in MCP package technology will be addressed along with some general fa instrument and methods.
本文将主要讨论现阶段一般的封装失效分析的技术与设备，并且重点研究失效分析技术在多芯片封装领域的应用。
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