The fracture toughness of silicon being bigger than ceramic, the cutting efficiency is higher because of the easier brittle chip formation mechanism.
由于硅晶体的断裂韧性小，锯切时容易形成破碎状切屑，去除率高于陶瓷。
The fracture toughness of silicon being bigger than ceramic, the cutting efficiency is higher because of the easier brittle chip formation mechanism.
由于硅晶体的断裂韧性小，锯切时容易形成破碎状切屑，去除率高于陶瓷。
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