Conductive gasket material is one of the most widely used shielding materials at present, and plays an important role on the suppression of electromagnetic slot -leakage in electronic equipment.
导电衬垫材料在抑制电子设备缝隙电磁泄漏中发挥了重要作用,是目前电子设备中应用最为广泛的一类屏蔽材料。
It is recognized that main reason of gasket plastic deformation is caused by the thermal expansion of gasket material and flange material.
认为垫圈材料与法兰材料的热膨胀差是造成垫圈塑性变形的主要原因。
The non - linearity of the gasket material was simulated, and the gasket stress and flange stress were computed with the 3D FEM in this paper.
采用有限元法模拟了垫片的非线性特性,计算了垫片应力及法兰应力。
The non - linearity of the gasket material was simulated, and the gasket stress and flange stress were computed with the 3D FEM in this paper.
采用有限元法模拟了垫片的非线性特性,计算了垫片应力及法兰应力。
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