The optimized immersion gold plating bath contains an organic additive which can slow down initiatory deposition rate, result in a slow dissolution of Ni-P substrate.
此工艺含有能够减缓镀金初始时沉积速率，又能降低对镍层腐蚀的添加剂。
The optimized immersion gold plating bath contains an organic additive which can slow down initiatory deposition rate, result in a slow dissolution of Ni-P substrate.
此工艺含有能够减缓镀金初始时沉积速率，又能降低对镍层腐蚀的添加剂。
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