Compatible with lead free soldering process.
兼容无铅焊接工艺。
The products do not contain lead and support lead free soldering.
本产品不含铅，可适用无铅焊料。
In this paper both lead borate sealing glasses and lead free phosphate sealing glasses are studied.
本文研究了含铅的硼酸盐封接玻璃和无铅磷酸盐封接玻璃。
The primary object of the present invention is to provide a substantially lead free alloy that is press quenchable.
本发明的主要目的是提供可模压淬火的基本不含铅的合金。
The lead free silver conducting pastes were prepared by using silver powder, lead free low-melting glass and terpineol ethyl cellulose solution.
以银粉、低熔无铅玻璃和乙基纤维素松油醇溶液制备了无铅银导电浆料。
This article describes the base material, surface finish, and process changes to consider when moving to a lead free product that will require UL Certification.
本文描述在实现需要UL认证的无铅产品时必须考虑的基料、表面处理和工艺变革。
This article describes the base material, surface finish, and process changes to be considered when moving to a lead free product that will require UL Certification.
本文描述了无铅产品在获得UL认证时，所需要考虑的基料、表面处理和工艺方面的变化。
Lead free products, RoHS compliant.
无铅产品，符合环保指令。
In the transition to lead-free from lead, there is expected to be a period when lead and lead-free materials will be used within the same mounting process for the manufacturers of electronic products.
在从有铅向无铅转换过程中，电子产品制造商不可避免会碰到同一组装过程中有铅和无铅的混合情况。
Each sculptural planter is made-to-order with handmade glass and lead-free solder and comes with everything you need but the plants.
每个艺术花盆都是定制的。它们由手工制作的玻璃和无铅焊料接合而成，交付使用时，万事俱备，只欠花卉。
Through the strict implementation of lead-free technology, we will continue to improve our product quality and continue to meet customer demand.
通过严格执行无铅工艺，我们将持续提高我们的产品品质，一如既往地满足客户的需求。
The solder alloys especially the lead-free solder alloys become the focus of study because of the quick development of the microelectronics and the surface mount technology (SMT).
随着微电子表面组装技术的迅猛发展，软钎料尤其是无铅钎料逐渐成为研究的焦点。
Therefore, electroplating of lead-free solder coating is one of investigation hotspots in electronic electroplating field.
因此，电沉积无铅可焊性镀层是电子电镀领域的研究热点之一。
It is unavoidable that lead-free solders are applied in SMT field in view of the environmental protection and the competitive motivation.
无论是环境的要求还是作为竞争的筹码，无铅钎料在表面组装领域中的应用已经是不可回避。
Research progress of lead-free solder, invalidation models of solder joint, solder joint reliability evaluation and the defects of solder joints in recent years have been reviewed.
笔者就近年来国内外开发的无铅焊料、焊点的失效模式、焊点可靠性评价方法和焊点的主要缺陷进行了综述；
Having optimized preheat temperatures, solder pot temperatures, and flux volume, the conveyor speed may have to be reduced to accommodate the solder wetting when using lead-free solder.
对预热温度、焊料槽温度和焊剂体积进行优化后，还可将传送带速度降低，以适应使用无铅焊料时的熔湿速度。
In combination of our recent results, the current status and prospect on lead-free solders has been introduced in detail.
结合我们的研究成果，详细介绍了无铅钎料开发的现状及前景。
In combination of the recent results, the current status and prospect on lead-free solders has been introduced in detail.
结合目前的研究成果，详细介绍了无铅钎料开发的现状及前景。
Generally the same fluxes will work for lead-free solder.
一般来说，相同的焊剂用于无铅焊料是有效的。
Nitrogen Protection is used in practical industry because of poor wettability of lead-free solder.
由于无铅钎料润湿性较差，在实际生产中普遍采用氮气保护。
BNKLT lead-free piezoelectric ceramics invented in authors' group were used for making middle frequency ceramic filters.
采用本组发明的BNKLT系无铅压电陶瓷，研制了中频陶瓷滤波器。
Thermal fatigue life of lead-free solder joint of Air-conditioner PCB (Printed Circuit Board) under the form of THT (Through Hole Technology) is studied.
本文对空调器印刷电路板(PCB)通孔插装形式无铅焊点的热疲劳寿命进行了研究。
In order to predict failure location of BGA lead-free solder joints under a drop impact, ABAQUS software is used to analysis stress distribution of the solder joints.
为了预测跌落碰撞下球栅阵列(BGA)封装中无铅焊点的失效，采用ABAQUS软件来模拟跌落碰撞过程中焊点的应力分布。
The piezoelectric and ferroelectric properties of the related systems are summarized. The preparation and the design of BNT-based lead-free piezoelectric ceramics are also introduced.
综述了BNT基无铅压电陶瓷的研究现状，讨论了相关体系的设计方法、铁电性、压电性以及BNT体系的制备方法。
The results showed that the lead-free PTC composites which had the size distribution of 30 ~ 70nm could be prepared by citrate sol-gel method.
实验结果表明：利用柠檬酸盐溶胶凝胶法可以合成颗粒粒径在30 ~ 70纳米的无铅ptc陶瓷粉体。
At last, the progress trend of lead-free solder is pointed out.
最后指出了无铅焊料的发展趋势。
Current status and trend of lead-free technology have been reviewed for electronic assembly manufacturing at home and abroad.
论述了国内外电子组装生产中无铅技术的现状及发展趋势。
To provide the steady, reliable and environment protection lead-free reflow technology.
提供成熟、可靠、环保的无铅回流技术。
To provide the steady, reliable and environment protection lead-free reflow technology.
提供成熟、可靠、环保的无铅回流技术。
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