The use of both lead and lead free solder is acceptable depending on the requirements set forth in the product specific documentation available in Agile.
铅和无铅焊料的使用取决于敏捷的产品的具体文件提出的要求是可以接受的。
The research on element interdiffusion, reaction and microstructure at the interface of solder joints is vital to the study of lead free solder joints reliability.
因此钎焊过程和服役过程中界面的反应、扩散以及界面的微观组织对当前无铝钎料可靠性研究具有重大意义。
Each sculptural planter is made-to-order with handmade glass and lead-free solder and comes with everything you need but the plants.
每个艺术花盆都是定制的。它们由手工制作的玻璃和无铅焊料接合而成，交付使用时，万事俱备，只欠花卉。
Research progress of lead-free solder, invalidation models of solder joint, solder joint reliability evaluation and the defects of solder joints in recent years have been reviewed.
笔者就近年来国内外开发的无铅焊料、焊点的失效模式、焊点可靠性评价方法和焊点的主要缺陷进行了综述；
Having optimized preheat temperatures, solder pot temperatures, and flux volume, the conveyor speed may have to be reduced to accommodate the solder wetting when using lead-free solder.
对预热温度、焊料槽温度和焊剂体积进行优化后，还可将传送带速度降低，以适应使用无铅焊料时的熔湿速度。
The solder alloys especially the lead-free solder alloys become the focus of study because of the quick development of the microelectronics and the surface mount technology (SMT).
随着微电子表面组装技术的迅猛发展，软钎料尤其是无铅钎料逐渐成为研究的焦点。
Generally the same fluxes will work for lead-free solder.
一般来说，相同的焊剂用于无铅焊料是有效的。
This article take Japan as an example, introduce technical topic and development direction of low temperature lead-free solder.
文章以日本为例，介绍低温无铅焊料的技术课题与开发方向。
So it is very necessary to study the wettability of lead-free solders and electromigration of solder joints.
因此开展低成本无铅焊料润湿性和焊点电迁移研究非常有必要。
In order to predict failure location of BGA lead-free solder joints under a drop impact, ABAQUS software is used to analysis stress distribution of the solder joints.
为了预测跌落碰撞下球栅阵列(BGA)封装中无铅焊点的失效，采用ABAQUS软件来模拟跌落碰撞过程中焊点的应力分布。
Nitrogen Protection is used in practical industry because of poor wettability of lead-free solder.
由于无铅钎料润湿性较差，在实际生产中普遍采用氮气保护。
Thermal fatigue life of lead-free solder joint of Air-conditioner PCB (Printed Circuit Board) under the form of THT (Through Hole Technology) is studied.
本文对空调器印刷电路板(PCB)通孔插装形式无铅焊点的热疲劳寿命进行了研究。
Then which solder is best fit for this model and the influence on fatigue of solder are known, when free-lead solder is used.
随后得出了不同焊料在此模型中的适用性及无铅工艺对焊点可靠度的部分影响。
Circulated nitrogen system is designed to improve the wettability and fluidness of lead-free solder and to ensure that the solder joints are shiny and bright.
氮气循环使用，增加无铅焊料的侵润性和流动性，使锡点饱满光亮。
Recycling waste tin material: lead-free solder recovery and recycling, tin tin slag the recycling, tin line recovery, solder paste recycling waste tin tin ash, such as waste lead recovery.
回收废锡料：无铅焊锡回收、锡渣回收、锡条回收、锡线回收、锡膏回收、锡灰等废锡废铅回收。
The main products are: solder wire, lead-free solder bar, line, lead-free solder paste, strips, tin ingots, flux, electroplating anode, babbitt, etc.
主要产品有：焊锡丝、焊锡条、无铅锡线、无铅锡条、锡膏、锡锭、助焊剂、电镀阳极棒、巴氏合金等。
At last, the progress trend of lead-free solder is pointed out.
最后指出了无铅焊料的发展趋势。
X-RAY-ray inspection using a lead-free solder paste of voids issue, found that the size and diameter welded hollow in acceptable range.
使用X-RAY射线检测了无铅锡膏的焊接空洞问题，发现焊接空洞的大小和直径都在可以接受范围内。
Through research, choose one or two lead-free solder paste.
通过研究，选择一种或两种无铅锡膏。
So study lead-free solder paste in the electronic application package is important.
因此研究无铅锡膏在电子封装中的应用具有重要意义。
Therefore, electroplating of lead-free solder coating is one of investigation hotspots in electronic electroplating field.
因此，电沉积无铅可焊性镀层是电子电镀领域的研究热点之一。
This paper's actual production of lead-free solder paste and lead-free soldering process has been systematically studied.
本文结合公司的生产实际，对无铅锡膏和无铅焊接工艺进行了系统研究。
Due to the consideration of environmental protection, the substitution of lead-containing solder with lead-free solder has become an inevitable trend in the 21st century.
进入21世纪，由于环境保护的要求，锡铅焊料将逐步被无铅焊料所取代。
Soldering flux meeting the lead-free requirements is used for the lead-containing solder paste manufactured by our company.
本公司生产的有铅锡膏已采用符合无铅要求的助焊膏。
The apparatus (1) enables copper which has dissolved in a lead-free solder comprising tin as the main ingredient to precipitate as an intermetallic compound to separate the copper.
该装置(1)可使溶出于包含以锡作为主成分的无铅焊料中的铜作为金属间化合物析出以分离铜。
The sequential thermal cycling (TC) and drop impact test is more reasonable to evaluate the reliability of lead-free solder interconnections compared with single TC test or drop impact test.
焊料微互连在热周期和跌落冲击顺序载荷下的可靠性研究更具有实际意义。
The cross-section test and dye&pry test are adopted to study the failure mechanism of CSP lead-free solder interconnection.
采用剖样实验和染色实验对无铅焊料微互连的失效机理进行分析。
The effects of X content on the conductivity, thermal conductivity, tin melting rate, dryness, and other physical properties of the new lead-free solder were studied.
研究了X含量对新型无铅焊料的导电性、导热性、熔锡速度和干燥度等物理性能的影响。
The results show that the free-lead solder powder is best in the efficient atomization efficiency, size distribution and degree of sphericity with helium as the atomizing medium.
结果表明：在一定雾化条件下，氦气雾化粉末具有最高的有效雾化率、良好的粒度分布，且球形度最好；
Lead-free solder bar is one kind of environmental-friendly product with good stability.
无铅锡条是一种环保型，稳定性很好的产品。
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