The leadless packaging structure reduces the packaging size of the semiconductor device and reduces the product cost.

本发明缩小了半导体器件的封装尺寸，降低了产品成本。

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The leadless packaging structure reduces the packaging size of the semiconductor device and reduces the product cost.

本发明缩小了半导体器件的封装尺寸，降低了产品成本。

youdao