• The application of the polyimide with low coefficient of thermal expansion in micro - electronics technology, soft - printing circuit plate were summarized.

    综述了低热膨胀聚酰亚胺微电子技术柔性印刷电路板方面的应用

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  • Synthetic diamond is competitive in heat dispersing materials, because it has high thermal conductivity, low coefficient of thermal expansion and lower price.

    人造金刚石由于自身导率热膨胀系数相对价格已成为制造新型散热材料的研究热点。

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  • Hypereutectic Al-Si alloy which has small proportion, low coefficient of thermal expansion, good wear resistance and dimensional stability is an ideal piston material.

    过共晶铝硅合金比重热膨胀系数低、耐磨性体积稳定性好,理想活塞材料

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  • The influences of lithia content on the melting temperature, mechanical properties and thermal expansion coefficient of low temperature frit were studied.

    本文研究了氧化锂加入低温熔融温度力学性能热膨胀系数影响

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  • The high coefficient of thermal expansion and low rigidity of many plastics increases the risk that the pipe will lose its dimensional stability.

    很多塑料热膨胀系数刚性增加(塑料)管道失去空间稳定性风险

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  • The high coefficient of thermal expansion and low rigidity of many plastics increases the risk that the pipe will lose its dimensional stability.

    很多塑料热膨胀系数刚性增加(塑料)管道失去空间稳定性风险

    youdao

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