As ICs continue to become more integrated and minimum feature sizes keep shrinking, the need for higher accuracy in fine pitch interconnect applications has become more important than ever.

随着芯片集成度的增加和尺寸的减小，芯片引脚间距越来越细密化，微电子封装的精度要求越来越高。

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As ICs continue to become more integrated and minimum feature sizes keep shrinking, the need for higher accuracy in fine pitch interconnect applications has become more important than ever.

随着芯片集成度的增加和尺寸的减小，芯片引脚间距越来越细密化，微电子封装的精度要求越来越高。

youdao