The two trends in the electronics packaging component field nowadays are the miniaturization in the size and high intensity in power.
尺寸小型化与功率高密度化是当今电子封装器件两大主要发展趋势。
Many changes to the personalization component in terms of the interface, packaging, and usage were made in this new release.
这个新发行版中的个性化组件在接口、打包和用法方面发生了许多变化。
Before packaging this component for redistribution, we would just comment out the @include line, assuming that the consumer's application will provide the database configuration we need.
在将此组件包装以便重复分发之前，我们所需做的只是注释掉 @include行，但前提是用户应用程序会提供我们所需的数据库配置。
There are a number of issues to consider when it comes to packaging a Zero component for reuse by other developers, and database access is the cause of many of them.
若要包装Zero组件以供其他开发人员重用，需要考虑的事情很多，而其中大多数问题都是由数据库访问引起的。
CXF does a good job at packaging an embeddable web service component that can be added to Spring for instance.
在打包一个可内嵌的Web服务组件(如可以加到Spring中)问题上，CXF做得很好。
Component packaging patterns allow for balance between the flexibility and other attributes of a distributed environment and the predictable performance of "local" component interactions.
组件打包模式允许在灵活性和分布式环境的其他属性以及“本地”组件交互的可预测性能之间求得平衡。
A strategy shift affects not just the tablet manufacturer, but also the various component makers, software suppliers and retailers that contribute to the tablet's packaging, assembly and sale.
定价战略的改变不仅会影响到平板电脑制造商，更会影响到各个零配件生产商，以及参与平板电脑功能打包、装配和销售的软件供应商和零售商。
One of the advantages of the Service Component Architecture is that you don't have to be concerned with the underlying packaging.
服务组件体系结构的优点之一是您无需关注底层的打包工作。
When packaging a Zero component for use in a production system, database configuration is of Paramount concern.
当包装zero组件以便在产品系统中使用时，数据库配置就显得至关重要。
The medicine packaging design, it has the same component factors, designing aims and similar methods as other packaging design.
阐述某一范围的设计活动，即药品包装设计。它有与其它包装设计一样的构成元素、设计目的，以及相似的设计方法。
Based on packaging carton CAD software, this paper gives a hierarchy model on component design of carton, method to realize component design, and an example of making up cartons to explain them.
基于包装纸盒CAD软件，给出了纸盒组件设计的层次结构模型和实现组件设计的方法，并以盒形拼大版为例加以说明。
A set of experiment-based technical scheme was established to determine the dynamic characteristics at system and component levels of a product-packaging-carrier system.
从系统分析的角度建立用于确定“产品-包装-运载体”在系统与部件水平的动态特性的实验技术理论。
The damage potential and evaluation method of a tangent nonlinear packaging system with critical component was investigated under the action of rectangular acceleration pulse.
研究了正切包装系统的关键部件在矩形脉冲激励下的冲击破损评价方法。
Perpetrators of the brands and products, packaging, style, quality and performance, is actually an important component of the product.
凶手与产品有关的品牌、包装、样式、质量及性能，是实际产品的重要组成部分。
Loose XAML is not a specific component or feature of an application model with a deployment and packaging infrastructure.
宽松XAML不是具有部署和打包基础结构的应用程序模型的特定组件或功能。
It is mainly used for the packaging of electronic component and PC boards.
主要用于电子元器件，PC板等的包装。
Its com component generating process includes creating engineer, adding m file and compiling creating components, packaging and distributing components. The.
其COM组件生成步骤含创建工程、添加m文件和编译创建组件、打包和分发组件。
The propaganda film of TV channel image is an important component of the overall TV program packaging which plays the role of creating channel image and establishing channel brand.
电视频道形象宣传片是电视整体包装的一个重要的组成部分，它有着塑造频道型形象、树立频道品牌的作用。
Packaging has become an important component of marketing.
包装已成为企业营销的重要组成部分。
The company ' s primary business is IC component packaging and test and memory module assembly.
公司的主要业务是集成电路封装测试和内存模块装配。
Since 1985 the MIXPAC System has been the most efficient packaging option for formulators and end-users of 2-component adhesives.
自1985年以来，MIXPAC胶枪系统一直都是效率最高的选择，对双组分胶水的最终使用者来说。
Due to the complicity of the component's functions and the variety of device's packaging, the component level testing is getting more and more difficult.
随着器件功能的日益复杂和封装的多样化，实现器件级的鉴定越来越困难。
Due to the complicity of the component's functions and the variety of device's packaging, the component level testing is getting more and more difficult.
随着器件功能的日益复杂和封装的多样化，实现器件级的鉴定越来越困难。
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