Semiconductor industry: semiconductor chip high cleanness-degree cleaning.
半导体行业：半导体晶片的高清洁度清洗。
"Actions chip" means the semiconductor chip designed and provided by Actions.
“炬力芯片”指炬力研发并提供的半导体芯片。
DRAM is a semiconductor chip used in most electronic products such as personal computers.
动态随机存取记忆体是应用于电子产品的半导体晶片，如个人电脑等。
Side surfaces and the second main surface of the semiconductor chip made thin are sealed with resin.
以及用树脂密封被减薄的所述半导体芯片的侧表面和所述第二主表面。
At least a semiconductor chip (such as a microphone chip) is arranged on the base part and right over the shield plate.
至少一个半导体芯片(例如麦克风芯片)安装在基座部上并且在屏蔽板的正上方。
The invention provides a semiconductor wafer, a semiconductor chip and a method and an apparatus for processing the wafer.
本发明提供了半导体晶片、半导体芯片及处理晶片的方法和设备。
The electrode portion is placed in a position which does not overlap with the sensor element in the thickness direction of the semiconductor chip.
电极部分设置于在半导体芯片的厚度方向上与传感器元件不重叠的位置。
Fixed abrasive wire saw is recognized as one of the best methods in cutting large size semiconductor chip and function crystal because of its incomparable advantages.
在大尺寸半导体基片和功能晶体的切割中。固结磨料线锯以无可比拟的优点被认为是最好的切割方法之一。
The semiconductor chip is made thin by grinding a second main surface opposing to the first main surface of the semiconductor chip which is connected with the substrate.
通过研磨所述半导体芯片的与所述第一主表面相对的第二主表面，使所述半导体芯片减薄，所述半导体芯片与所述基板相连接；
This paper describes the internal circuit of the DIP-CIB module, semiconductor chip technologies, package technologies and general purpose inverter design by using HVIC and the DIP-CIB module.
在此详细介绍了DIP -CIB模块的内部电路、半导体硅片技术、封装技术，以及如何配合专用的HVIC来实现通用变频器的小型化设计。
This paper describes the internal circuit of the DIP-CIB module, semiconductor chip technologies, package technologies and general purpose inverter design by using HVIC and the DIP-CIB module.
在此详细介绍了DIP -CIB模块的内部电路、半导体硅片技术、封装技术，以及如何配合专用的HVIC来实现通用变频器的小型化设计。
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