The result of simulation indicated that higher printing velocity and printing pressure would improve the performance of solder paste printing if other factors were not considered.
研究表明：在不考虑其他焊膏印刷性能影响因素下，较高的印刷速度和印刷压力能提高焊膏印刷性能。
The result of simulation indicated that higher printing velocity and printing pressure would improve the performance of solder paste printing if other factors were not considered.
研究表明：在不考虑其他焊膏印刷性能影响因素下，较高的印刷速度和印刷压力能提高焊膏印刷性能。
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