The solder collecting method utilizes the solder collecting device to carry out the reliability testing of high-speed ball push test so as to conveniently collect the solder remains.
所述焊料收集方法即是利用所述焊料收集装置进行一高速推球实验的可靠性测试，以方便收集所述焊料残骸。
The solder collecting method utilizes the solder collecting device to carry out the reliability testing of high-speed ball push test so as to conveniently collect the solder remains.
所述焊料收集方法即是利用所述焊料收集装置进行一高速推球实验的可靠性测试，以方便收集所述焊料残骸。
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