Apply to factory and individual electronic product soldering tin handle.
适用于工厂及个人电子类产品焊锡作业。
Suitable for reflow when cheat protection, electronic circuit boards wave soldering tin stove and shelter.
适用于回流焊时对金手指的保护，电子线路板过锡炉和波峰焊锡遮蔽。
The invention relates to a soldering tin furnace part, in particular to a tin wave generating device on a soldering tin furnace.
本发明涉及焊锡炉部件，尤其是一种焊锡炉上的锡波发生器。
The present invention is lead-free soldering tin technology, and relates to soldering technology of electronic device and element.
一种无铅焊锡技术，涉及电子元件及器件用焊接用焊锡技术。
Using oil as heating medium to heat soldering tin, then disassemble it by ultrasonic vibration and consequently disassemble the PCB's components.
采用油作为加热介质对焊锡进行加热，再通过超声波振动去除电路板上的焊锡，从而把电路板上的元器件拆卸下来。
The soldering tin jet device according to the invention has the advantage that: the tin surface is level and uniform and soldering yield can be enhanced.
本发明的有益效果是：本发明一种焊锡喷锡装置的锡面平等均匀、可提升焊接良率。
Electronic circuit boards for wave soldering tin shelter, protect the finger and high-end electrical insulation, motor insulation, and the lithium battery positive and negative and ears fixed.
适用于电子线路板波峰焊锡遮蔽、保护金手指和高档电器绝缘、马达绝缘，以及锂电池正负及耳固定。
Tin has replaced lead, which is more toxic, in a lot of soldering.
的确，锡已经取代了在焊接时会产生大量有害物质的铅的王者之位。 由于锡毒性较弱，它已在许多焊接过程中取代了铅。
The circuit board is placed in the welding stage, the pins through hole components welding, choose appropriate spray tin, soldering start.
将电路板放置在焊台上，针对需要焊接的通孔元件管腿，选择合适的喷锡口，启动波峰焊接。
Take the powder of tin, silver and copper solder as the basis to make solder paste and simulate soldering.
以自制的锡银铜系焊粉为基础制备焊膏并做焊接模拟。
The design of absorb tin gun and soldering iron is lightweight, suitable for prolonged use.
吸锡枪及焊铁设计轻巧，适合长时间使用。
Tin spray applied to circuit boards, hot air leveling and wave soldering, welding and hot dip tin lead anyone.
适用于电路板喷锡，热风整平，波峰焊、热浸焊和引线搪锡。
Apply to wave soldering, welding and hot dip high-grade iron tin wire.
适用于波峰焊、热浸焊和高档引线搪锡。
Apply to the high-grade circuit boards wave soldering, welding and hot dip high-grade iron tin wire.
适用于高档电路板的波峰焊、热浸焊和高档引线搪锡。
Many electronics manufacturers will transition their soldering processes from traditional tin-lead alloys to lead-free alloys before 2006.
许多电子制造商将在2006年前从传统的锡铅合金钎焊工艺改变为无铅合金的钎焊工艺。
Heat up your soldering iron and tin it by allowing it to melt a drop of solder onto its tip.
加热你的电烙铁，通过允许其热量融化的一滴锡滴在它的尖端来锡化它。
Heat up your soldering iron and tin it by allowing it to melt a drop of solder onto its tip.
加热你的电烙铁，通过允许其热量融化的一滴锡滴在它的尖端来锡化它。
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