• The fracture of the electronic components is predicted through Comparing the experimental data of strain energy release rate.

    对比能量释放试验数据,对电子元件断裂进行了预测。

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  • The strain energy release rate of the crack propagation was calculated by using virtual crack closure technique, and fatigue life was forecasted.

    采用虚拟裂纹闭合技术计算裂纹扩展应变释放裂纹扩展寿命进行计算。

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  • The results show that the stress intensity factor is independent of material constants, and the strain energy release rate is dependent on all material constants.

    结果表明应力强度因子材料常数无关,应变释放依赖所有材料常数。

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  • The two dimensional accurate solution is obtained on plane strain assumption, the numerical results of strain energy release rate and crack tip energy release rate are presented.

    平面应变假设下给出精确解,并提供了机械应变释放能量释放率等数值结果

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  • And then, substituting stress and displacement into basic formula of strain energy release rate, computing formula for strain energy release rate of mode III, mixed mode crack tips are direved.

    其次应力位移代应变释放基本公式,推出了Ⅰ、Ⅱ混合型,Ⅲ以及Ⅰ、Ⅱ、Ⅲ混合型裂纹尖端应变能释放率的具体计算公式。

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  • A release rate tensor of damage strain energy is derived.

    推导损伤应变释放量。

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  • The equations of loading and bounding surfaces are described in strain-energy release rate.

    加载面边界方程损伤能量释放率表示。

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  • Criterions based on element strain level and energy release rate respectively were applied with the cohesive elements to estimate the initiation and evolution of the delamination.

    根据基于应变失效准则能量释放准则判断分层损伤起始和扩展,界面单元的失效表征分层扩展。

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  • Criterions based on element strain level and energy release rate respectively were applied with the cohesive elements to estimate the initiation and evolution of the delamination.

    根据基于应变失效准则能量释放准则判断分层损伤起始和扩展,界面单元的失效表征分层扩展。

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