Surface mount fuse, fast acting.
表面贴装型、快速熔断；
Thin surface mount ceramic package.
薄形陶瓷表面贴封装。
Spherical contact on display, one of surface mount package.
球形触点陈列，表面贴装型封装之一。
The ACS706 is provided in a small, surface mount SOIC8 package.
ACS706以体积小、表面安装的SOIC 8封装的形式提供。
Surface mount LED lamp. Super bright green. Lens type water clear.
表面贴装LED灯。超级明亮的绿色。镜头类型的水清除。
Purpose: General purpose amplifier for surface mount applications.
用途： 适用于表面贴装的一般放大电路。
Surface Mount Component Reflow repair on various substrate materials.
表面贴装元件回流可修复不同衬底材料。
This Standard covers requirements for taping surface mount components.
这个标准包括把表面登上组分录音的要求。
Surface mount devices are packaged on tape and reel for easy auto placement.
表面贴装器件封装在磁带和卷轴，便于自动布局。
This device provides bounce-free switching in a compact surface mount package.
该器件提供免费的弹跳开关在一个紧凑的表面贴装封装。
The wave soldering process may advance welding on the surface mount components damage.
采用波峰焊工艺可能会对先期焊接的表面贴装元件造成损伤。
Machine vision system is one of key parts in the multi-function surface mount equipmens.
机器视觉系统是多功能贴片机不可缺少的核心部分。
In surface mount assembly, the stencil is the gateway to accurate, repeatable solder paste deposition.
表面贴装，钢网是锡膏准确重复印刷的关键。
Surface mount BGA Packaging Technology for high-speed Optoelectronic modules is described in this paper.
本文介绍了用于高速光电组件的表面安装型焊球阵列（BGA）封装技术。
The two chips are mounted on a ceramic substrate, and then hermetically sealed in a ceramic surface mount package.
这两款芯片安装在陶瓷基板，然后密封在一个密封的陶瓷表面贴装封装。
By adopting the Surface Mount Technology (SMT), the circuit is compact structured in a reasonably arranged layout.
电路采用贴片技术，结构紧凑、布局合理。
Surface mount fast switching rectifier. Max repetitive peak reverse voltage 200 V. Max average forward current 1.0 a.
表面贴装快速开关整流器。最大反向重复峰值电压200五，最大平均正向电流1.0A。
It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package.
它提供了在任何现有的表面上的最高权力能力和最低的导通电阻封装。
Surface mount ultrafast rectifier. Max recurrent peak reverse voltage 400 V. Max average forward rectified current 2.0 A.
表面贴装超快整流器。最大的经常峰值反向电压为400 V，最大平均整流电流2.0A。
All the packaging of its components are Surface Mount Device (SMD), and we use software to instead of some hardware circuits.
它所有的器件采用贴片封装，用软件来代替部分硬件电路。
Surface mount fast recovery rectifier. Maximum recurrent peak reverse voltage 50 V. Maximum average forward rectified current 1.0 a.
表面贴装快速恢复整流。经常性最大峰值反向电压50V最大平均正向整流电流1.0 A。
Surface mount fast recovery rectifier. Maximum recurrent peak reverse voltage 400 V. Maximum average forward rectified current 1.0 a.
表面贴装快速恢复整流。经常性最大峰值反向电压400V，最大平均整流电流1.0A。
Summarizing the actuality of surface mount inductor, Introduces emphatically the manufacture technology and market of surface mount inductor.
概述了片式电感器现状，着重介绍了片式电感器制造技术与市场。
The wave soldering process may advance welding on the surface mount components damage. Now a lot of circuit board with surface mount components.
采用波峰焊工艺可能会对先期焊接的表面贴装元件造成损伤。现在很多电路板上以表面贴装元件为主。
In the early 1990s Universal developed a modular platform concept and shipped its first platform-based surface mount technology machines in 1993.
90年代初，公司开发出组合平台概念，于1993年首次运交平台支持平面安装技术机器。
The sensing element and the measuring ASIC are assembled in a dual-in-line (DIL) plastic package with pins for surface mount and re-flow soldering.
加速度计的敏感元及测量专用芯片（ASIC） 集成在DIL塑料封装内，其引脚可用于表面安装和回流焊接。
Encapsulated surface mount electronics provide resistance to water, oil, dirt, high temperatures, shock and vibrations and overall harsh environments.
表面贴装电子封装提供抗水，油，灰尘，高温，冲击，振动和整体恶劣环境。
A fast three-step path planning algorithm was proposed for automatic optic system to inspect electronic product defects by using surface mount technology.
针对检测表面贴片产品缺陷的光学检测系统，提出一种三阶段的快速路径规划算法。
A fast three-step path planning algorithm was proposed for automatic optic system to inspect electronic product defects by using surface mount technology.
针对检测表面贴片产品缺陷的光学检测系统，提出一种三阶段的快速路径规划算法。
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