Maximum thermal dissipation of the slot in Milliwatts.
以毫瓦表示的插槽的最大温度散发。
The business unit's capabilities including photolithography, micro-etch and small scale thermal dissipation technology.
该业务部门的技术能力包括照相平版印刷、微蚀刻和小规模散热技术。
In this thesis, the power combining circuits, thermal dissipation, test in the SSPA design and implementation are discussed and conducted.
论文主要从功率合成电路、热设计和测试三个方面，论述了该功放的设计和实现。
However, due to the modes of feeding and thermal dissipation structure, the improper design and use have resulted in shortening the service life of LED.
但是由于馈电方式和散热结构等问题，设计使用不当会造成LED使用寿命的大大缩短。
Based on PTC Resistance -temperature characteristics, we develop a tachometer on thermal dissipation. In this paper, structure and principle of the tachometer on thermal dissipation are discussed.
根据PT C电阻-温度特性，研制了热耗散转速仪，并阐述了热耗散转速仪的结构和原理。
Analyzing the actual research progress and targets, we can make a conclusion that Thermal Dissipation Method will be the vital techniques on stem SAP flow measurement and calculation in the future.
对现有的研究成果和研究目标进行分析认为，热扩散方法将成为未来几年研究树木液流的重要测算方法。
The new DDI package improves thermal heat dissipation by 20 percent over a conventional COF package, allowing the DDI to last longer and operate with greater reliability.
这一新型的DDI装置相比传统的COF能提高散热量达20%，因此使得DDI能运行更长时间，并且可靠性更好。
The effect of the thermal resistance at two interfaces on heat dissipation capability of the SWS is analyzed.
分析了两个接触处的界面热阻率对慢波结构散热性能的不同影响。
Heat capacity, heat dissipation ability, a sign of thermal runaway, the manipulating ability;
热容量大，热消散能力强，对热失控征象，自操纵能力强；
It is found that if the cavity dissipation is very weak and the average photon number of thermal environment is very small, the atom-field state can exhibit quantum nonlocality periodically.
结果显示，如果腔损耗很弱，热库的平均光子数很小，系统会周期性地展现出量子非局域性。
It is an excellent heat-sinking adhesive and is recommended for thermal management applications where good heat dissipation is needed.
它是非常优秀的散热粘合剂，尤其推荐使用在需要良好散热的应用上。
The influences of the PTCR's characteristic parameters such as switching temperature, room resistance of samples, and dissipation coefficient, etc. on the thermal power of heaters are investigated.
主要研究了PT C材料的开关温度、样品的室温电阻及耗散系数等特性参数对发热体功率的影响。
The heat-skin use alloy die-casting material with high thermal conductivity, which is much better for heat dissipation than normal materials and thus extends the working life of LED lights.
采用具有导热性能高的铝压铸材料，散热功能优于普通材料，增强了LED灯具的使用寿命。
The method for calculating power dissipation and some cautions for thermal design are provided in the end.
最后介绍了计算系统功耗的方法和芯片散热设计的注意事项。
Passive cooling is a building design approach that focuses on heat gain control and heat dissipation in a building, in order to improve the indoor thermal comfort with low or nil energy consumption.
无动力制冷是一个建筑设计的新方式，设计师们更多的关注热量的吸收控制和热量的损耗，以保证室内的温度宜人和能源的零消耗。
The article stresses the introduction of thermal balancing analysis of oil tank in hydraulic system, and parameter calculation of cubage and area of dissipation.
重点介绍液压系统中油箱的热平衡分析及其容积和散热面积参数的计算。
The effect of nonmetallic thermal conductive interface materials on the heat dissipation of HPLED lamp model was studied at the second interface under different temperatures.
研究了不同的非金属基导热界面材料在不同环境温度条件下，应用于HPLED灯具模型中的第二界面处时对灯具散热情况的影响。
By analyzing one-dimensional spindle heat conduction difference model, a model was set up based on the energy input, dissipation and thermal deformation of the spindle.
通过分析一维主轴热传导差分模型，建立起基于反馈原理的机床能量输入、输出的热变形预报模型。
Composite silicone rubber with good thermal conductivity as elastomeric thermal pads for heat dissipation was prepared using Al2O3 or BN fillers.
所制备的复合硅橡胶具有很好的物理性能，是作为散热使用的弹性导热垫片的理想材料。
Due to the poor thermal conductivity of composite materials, heat dissipation of the machine is severe, and heat performance estimate becomes vital during continuous discharges.
由于复合材料导热性能较差，导致电机整体的散热性能不佳，因而连续放电运行时电机的热性能预估显得十分重要。
If internal power dissipation becomes too high for the heat sinking provided, the thermal shutdown circuit takes over preventing the IC from overheating.
如果内部功耗变得太大，热量高沉没的规定外，热关断电路采用了防止芯片过热。
If internal power dissipation becomes too high for the heat sinking provided, the thermal shutdown circuit takes over preventing the IC from overheating.
如果内部功耗变得太大，热量高沉没的规定外，热关断电路采用了防止芯片过热。
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