• Based on the old non-bright tin electroplating, the sealing process was added.

    在原有的雾面锡电镀工艺基础上,增加了封闭工序。

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  • An additive for matt pure tin electroplating was developed by electrochemical and chemical methods.

    运用电化学和化学方法开发了一种亚光纯锡电镀添加剂。

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  • The impedance spectrum of the electroplating tin anode for Li-ion batteries is measured at various states of charge(alloying)and after charge-discharge cycles.

    测试了锂离子蓄电池电镀锡阳极在不同充电(合金化)状态和不同充放电循环次数后的电化学阻抗谱。

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  • The main products are: solder wire, lead-free solder bar, line, lead-free solder paste, strips, tin ingots, flux, electroplating anode, babbitt, etc.

    主要产品有:焊锡丝、焊锡条、无铅锡线、无铅锡条、锡膏、锡锭、助焊剂、电镀阳极棒、巴氏合金等。

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  • Tin welding parts and lead-tin alloy die casting, zinc, beryllium bronze, phosphorus copper alloy in electroplating copper with commonly used before also gets to improve adhesion.

    锡焊件、铅锡合金、锌压铸件、铍青铜、磷铜等合金在电镀前也常用预镀铜来改善结合力。

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  • Main technical requirements of pure tin plating bath common used for electronic component and device electroplating were introduced.

    介绍了目前常用于电子元器件电镀纯锡液的主要技术要求。

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  • Tin - bismuth alloy was electroplating by electrodepositing associated with ultrasonic agitation.

    将超声和电沉积相结合电镀了锡铋合金。

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  • The classification, characteristics, and application results of tin, tin lead and tin bismuth electroplating were summarized.

    总结了电镀锡、锡铅合金和锡铋合金的分类、特点及应用情况。

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  • A new technology of tin-nickel alloy electroplating from a pyrophosphating bath was studied. The effect of some plating parameters on the tin-nickel alloy coating was discussed.

    研究了从焦磷酸盐槽液中电镀锡镍合金的一种新工艺,讨论了一些电镀参数对锡镍合金镀层的影响。

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  • Lead, tin and tin-lead alloy electroplating technologies using these two products are introduced.

    介绍了采用两种产品的电镀铅、锡及铅-锡合金工艺。

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  • Tin Grains:Our tin grains are of moderate size. Special alloy compositions are available upon request. This product is an ideal material applied to the existing electroplating techniques.

    锡粒:本公司生产的锡粒大小适中,其合金成份可依据不同要求而定制。对目前的电镀工艺应用较为适合。

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  • Methane sulphonic acid (MSA) has the right combination of properties for electroplating baths containing lead, tin, copper, nickel and some precious metals.

    在含有铅、锡、铜、镍和一些贵金属的电镀池中,甲磺酸(msa)是一种很好的电解质。

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  • Ultrasonic is used for tin-cerium alloy electroplating.

    将超声波应用于锡铈合金电镀。

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  • The effects of ultrasonic on the tin-bismuth alloy electroplating are studied.

    研究了超声波对锡铋合金电镀的影响。

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  • Sulfate tin plating process has been widely used in electroplating industry for its strengths such as high current efficiency, fast plating rate, low cost and easy effluent disposal.

    硫酸盐光亮镀锡工艺具有电流效率高、沉积速度快、成本低及废水易处理等优点,在电镀生产中已广泛应用。

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  • The result proves that the process has advantages of high stabilization, excellent solderability and antitarnishing, which may replace high-pollution tin-lead electroplating technology.

    结果表明,该添加剂工艺稳定性好,且镀层可焊性优良、抗变色能力强,可取代高污染的锡铅电镀工艺。

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  • A soft electromagnetic shielding fabric was successfully prepared by electroplating tin-nickel alloy on the Cu-plated PET fabric in potassium pyrophosphate system.

    本文研究了在化学镀铜的聚酯纤维织物表面采用焦磷酸盐体系电沉积锡镍合金的工艺条件以及合金镀层织物的性能。

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  • A soft electromagnetic shielding fabric was successfully prepared by electroplating tin-nickel alloy on the Cu-plated PET fabric in potassium pyrophosphate system.

    本文研究了在化学镀铜的聚酯纤维织物表面采用焦磷酸盐体系电沉积锡镍合金的工艺条件以及合金镀层织物的性能。

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