We have determined tin and lead contents in tin solder using the XRF fundamental parameter method without standard sample in this paper.
本文在无标样的情况下，用X射线荧光基本参数法测定了焊锡中的锡和铅的含量。
The method is proved to be accurate, reliable, convenient and quick, absolutely suitable for the assaying of trace lead in silver tin solder.
方法准确、可靠、简便、快速，完全适用于银锡焊料中微量铅的检验。
The paper introduces the laser cut mould plate, the characteristics of tin solder and some problems which should be paid attention to in screen printing.
重点介绍了激光切割成型的模版、锡焊膏的特点及丝网印刷中应注意的问题。
The paper introduces the laser cut mould plate, the characteristics of tin solder and some problems which should be paid attention to in screen printing.
重点介绍了激光切割成型的模版、锡焊膏的特点及丝网印刷中应注意的问题。
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