Many electronics manufacturers will transition their soldering processes from traditional tin-lead alloys to lead-free alloys before 2006.

许多电子制造商将在2006年前从传统的锡铅合金钎焊工艺改变为无铅合金的钎焊工艺。

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As electronics manufacture seek to make electronic interconnectio lead-free, many are looking at pure tin soldering and coating as an economical alternative to traditional tin-lead alloys.

随着电子产品制造寻求使电子互连无铅很多人都在找纯锡焊和涂层作为一个经济的替代传统的锡铅合金。

youdao

As electronics manufacture seek to make electronic interconnectio lead-free, many are looking at pure tin soldering and coating as an economical alternative to traditional tin-lead alloys.

随着电子产品制造寻求使电子互连无铅很多人都在找纯锡焊和涂层作为一个经济的替代传统的锡铅合金。

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