A perforated metal wafer carrier is also used for wafer bonding for easy handling and de-bonding.
穿孔金属晶片载体也用于晶片键合，用以容易地处理以及松解。
In the last two years, Electroglas has made major new technology introductions for 200mm and 300mm wafer probing and final test handling.
在过去的两年中，伊智主要为200mm和300 mm晶圆探针台和封装测试处理引入了新的技术。
In the last two years, Electroglas has made major new technology introductions for 200mm and 300mm wafer probing and final test handling.
在过去的两年中，伊智主要为200mm和300 mm晶圆探针台和封装测试处理引入了新的技术。
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