测试发现热暴露在一定程度上降低了原抛光试样表面的残余压应力水平。
Compared with the polished specimens, the surface residual stress of the post-exposed specimens was also compressive, but much lower.
测试发现热暴露在一定程度上降低了原抛光试样表面的残余压应力水平。
Compared with the polished specimens, the surface residual stress of the post-exposed specimens was also compressive, but much lower.
应用推荐