A copper line having self assembled monolayer for use in ULSI semiconductor devices and methods of making the same are presented.
本发明提供用于ULSI半导体器件的具有自组装单分子层的铜线及其制造方法。
The copper line includes an interlayer dielectric, a self-assembled monolayer, catalytic particles on the monolayer, and a copper layer on the monolayer with the catalytic particles.
层间电介质、自组装单分子层、在该单分子层上的催化颗粒、以及在具有催化颗粒的单分子层上的铜层。
The copper line includes an interlayer dielectric, a self-assembled monolayer, catalytic particles on the monolayer, and a copper layer on the monolayer with the catalytic particles.
层间电介质、自组装单分子层、在该单分子层上的催化颗粒、以及在具有催化颗粒的单分子层上的铜层。
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