This study is intended to evaluate the bondability and reliability of single crystal copper wire bonding.
本研究的目的是评估单晶铜引线接合的接合性和可靠性。
In this paper, the forming process of copper wire ball in copper ball bonding has been studied by numerical simulation.
本文采用数值模拟的方法研究了铜丝球键合技术中的形球过程。
Several silk materials including gold silk, copper silk and aluminum silk used as conductor in wire bonding technology in electronics packaging materials were introduced.
介绍了电子封装材料中用于引线键合工艺的几种主要导电丝材料，包括金丝、铜丝和铝丝。
The paper presents an study of copper clad steel wire produced by liquid and solid bonding method. Using the finite difference equation, the dipping process is analyzed.
以液固相反向凝固法生产的包铜钢线为研究对象，利用有限差分法分析了铜在钢线芯体上的浸覆过程；
The paper presents an study of copper clad steel wire produced by liquid and solid bonding method. Using the finite difference equation, the dipping process is analyzed.
以液固相反向凝固法生产的包铜钢线为研究对象，利用有限差分法分析了铜在钢线芯体上的浸覆过程；
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