The invention discloses a hydraulic driven side powder metallurgy die carrier.
本发明公开了一种液压驱动侧置的粉末冶金模架。
This die carrier is with convenient assembly, universal purpose property suitable for gear billet closed forming.
该模架组装方便，适用于齿轮坯闭式模锻，并且具有通用性。
The invention solves the problem of increase of the whole height, thus optimizes the structure of the die carrier.
本发明较好地解决了模架的整体高度增加的问题，从而优化了模架的结构。
Design procedure and working principle of a automatic die carrier for assembling a bushing into guide sleeve are presented.
本文介绍了压装导向套内衬的自动模架的设计方法和工作原理。
Introducting a gear billet forming die carrier structure used on friction press for no fash forming discusses die carrier guide, ejector pins and main elements selection of materials, heat treatment.
介绍了一种在摩压机上采用无飞边模锻齿轮坯的模架结构。对模具的导向、顶料装置以及主要构件的选材、热处理进行了论述。
Introduced the pressing technology analysis, the carrier choosing, layout designing and structure design of the progressive die for the swinging connecting rod.
介绍了摆动连杆的冲压工艺分析过程、载体的合理选择、带料排样方案的确定及级进模模具的总装结构设计。
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路倒装芯片封装中半导体铸模和载波器的焊料中的铅；
Firstly the structure of stamping progressive die was analyzed, and then the design of main contents such as the multi-position progressive die of layout design and strip carrier were stated.
对冲片连续模的结构进行分析，阐述了多工位连续模的排样设计、条料载体设计等主要内容。
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
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