The dispersion effects of several typical kinds of surfactants on nickel electroplating bath were studied.
以镍电镀液为分散介质，研究了几种典型类型表面活性剂的分散效果。
The zinc electroplated strip is characterized in that it is plated with the zinc electroplating bath composition.
镀锌片的表征条件为：使用渡锌液混合物来电镀。
The result showed that the mode of sample entering electroplating bath with electrification and without impact current could made the adhesion harder.
研究结果表明选择带电入池，无冲击电流方式时，可增强银镀层的结合力。
JP-2000 192279, Cyanide-free electroplating bath for silver and silver alloy coating, using fatty sulphurous compounds that are stable for a relatively long time.
本文介绍了国内无氰镀银研究情况，部分翻译了日本专利特开2000-192279，介绍银及其合金的无氰电镀液组分及工艺，镀液比较稳定。
A very stable emulsion was obtained with addition of one additive in Watts nickel electroplating bath. Using the emulsion an even satin-finished nickel coating was prepared.
在瓦特镍镀液中加入添加剂后获得较稳定的悬浊液，利用这种镀液制得珠光效果良好的珍珠镍镀层。
The fused salts as solvents for preparing electroplating bath have some important features, that is, their wider temperature range of liquid state and larger "electrochemical window".
用熔盐作为制备金属电沉积槽液的溶剂具有液态温度范围广和“电化学窗口”大等优异特点。
The Pd-Ni electroplating bath types and characteristics are comprehensively introduced, the methods improved property of Pd Ni coating to adapt to electron industry are also presented.
综述了钯镍合金常见的镀液类型及其特点，介绍了一些改进和提高镀层质量以适应电子工业技术要求的措施。
Electroplating is an electrochemical process by which metal is deposited on a substrate by passing a current through the bath.
电镀是一种在电镀槽通上电流使金属沉 淀在基体上的电化学过程。
Nickeltungsten alloy coating was deposited on copper plate making use of electroplating in the bath composed of nickel sulfate, sodium tungstate, and trisodium citrate.
采用硫酸镍、钨酸钠和柠檬酸三钠为基本组分的镀液，通过电镀的方法在紫铜试片上沉积得到了镍钨合金镀层。
The insoluble and colloidal nickel hydroxide formed in electroplating is the main cause for the deterioration of bath and plating.
在电镀过程中所产生的不溶的、胶态状的氢氧化镍是造成镀液和镀层质量恶化的主要原因。
A new electroplating technology of solderable bright Sn-Sb alloy of bath components and operating conditions were studied.
研究了一种新型可焊性光亮锡锑合金电镀工艺的镀液配方和电镀操作条件；
Main technical requirements of pure tin plating bath common used for electronic component and device electroplating were introduced.
介绍了目前常用于电子元器件电镀纯锡液的主要技术要求。
The effect of bath composition, operating conditions and additives on Sn content of electrodeposits during the process of Sn-Ni alloy electroplating in alkaline baths had been studied.
在研究碱性锡镍合金的电沉积过程中，讨论了镀液中各成分的含量、电镀工艺条件的改变及添加剂对锡镍合金镀层成分和外观的影响规律。
Various bath compositions for electroplating of aluminium in organic solvents and molten salts, as well as plating conditions and parameters are reviewed.
综述了有机溶剂和熔融盐电镀铝的各种镀液配方和施镀情况及相关参数。
The first layer encases the eternal surfaces of the metallic core and is produced by electroplating copper or copper alloy from a first bath containing copper ions.
第一层包覆所述金属芯的外表面，并且通过从包含铜离子的第一浴中电镀铜或铜合金产生。
In this article, the effects of rare earth on Zn-Ni alloy electroplating from sulfate bath have been studied.
研究了稀土在硫酸盐体系电镀锌镍合金中的作用。
A new technology of tin-nickel alloy electroplating from a pyrophosphating bath was studied. The effect of some plating parameters on the tin-nickel alloy coating was discussed.
研究了从焦磷酸盐槽液中电镀锡镍合金的一种新工艺，讨论了一些电镀参数对锡镍合金镀层的影响。
Pure nickel deposits were obtained from the traditional Watt nickel plating bath by pulse electroplating.
采用传统的瓦特镀液通过脉冲电镀制得纯镍镀层。
The process of cyanide-free silver pulse electroplating is investigated in 5,5-dimethyl hydantoin(DMH) bath.
研究了5，5-二甲基乙内酰脲（DMH）无氰脉冲镀银工艺。
The process of cyanide-free silver pulse electroplating is investigated in 5,5-dimethyl hydantoin(DMH) bath.
研究了5，5-二甲基乙内酰脲（DMH）无氰脉冲镀银工艺。
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