主营：IC芯片，连接器！
Phase-locking loop circuit, phase shifting method, and IC chip.
锁相环电路，相移方法，及集成电路芯片。
Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.
机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备。
With the advent of the era of deep sub-micron IC, the feature size on the IC chip is shrunk to nanometers.
伴随着深亚微米集成电路时代的来临，芯片的特征尺寸已经缩小到纳米尺度。
On the front of outer packing, there's printing of "Dual Core IC Chip Inside" and all the hosts that it supports.
外包装正面有双核字样以及市面上支持所有型号的主机。
The present invention may improve quality factor of the spiral inductor structure and integrate the same onto the IC chip.
本发明能够提高螺旋电感结构的品质因数，并可将其整合于IC芯片上。
It proves that the designed parallel bonding mechanism meets the working requirements of IC Chip Die by these characteristic curves.
根据这些曲线，说明所设计的并联焊头机构能满足IC芯片粘片机的工作要求。
It introduces the operation principle and hardware and software design of a IC chip test instrument based on AT89C52 chip microcomputer.
介绍了采用AT 89 C5 2单片机设计的集成芯片测试仪的工作原理及硬软件设计。
A video character superimposition system is designed based on the IC chip MB90092, and the design of the software for MB90092 is discussed.
基于MB90092芯片设计了视频字符叠加系统，以此为基础论述了MB90092的软件设计方法。
The test circuit receives the second clock signal and the first clock signal outputted by the first IC chip to generate a comparable signal.
检测电路接收第二时钟讯号和第一集成电路芯片所输出的第一时钟讯号，以产生一比较讯号。
AD73360 is a programmable three-phase electrical parameter measurement IC chip. It is mainly used in industry ammeter and multi-input systems.
AD 73360是一主要适用于工业电表和多路输入系统的可编程三相电量测量ic器件。
An IC chip is mounted by flip chip or wire bonding or adhesive connection on the face of the metal substrate which has the dielectric coating thereon.
IC芯片以倒装焊接或金属线焊接或粘贴连接安装于金属基片的有介质涂层的表面。
Based on these characteristic curves, it proves that the moving stiffness of the designed Parallel Bonding Mechanism meets the working requirements of IC Chip Die.
根据这些曲线，说明所设计的并联焊头机构的动刚度能满足IC芯片粘片机的工作要求。
The integral period sampling, which is realized by realtime frequency calculation and voltage capture function of IC chip, is necessary for precise digital signal processing.
借助芯片的捕获功能，计算信号的实时频率，实现了整周期采样，保证了数字信号处理的精度。
TI's TMS320VC5402 DSP IC chip is used as the central processor of the system so that the video acquisition, video image extract and data analysis can be integrated into one system.
该系统采用TI公司TMS320VC5402DSP芯片作为核心处理器，可以对来自于摄像头的模拟视频信号中的图像进行采集、提取、分析一体化处理。
An antenna coil of a reader or writer apparatus for communicating with the IC chip is arranged on the side of an optical pickup module which faces a rotary axis of the optical disc.
用于与IC芯片进行通信的读取器或记录器装置的天线线圈相对于光盘的旋转轴设置在光头模块的相对侧。
Arranging chip capacitors (20) in a printed wiring board (10) makes it possible to reduce the distance between an IC chip (90) and the chip capacitor (20) and to reduce the loop inductance.
因为在印刷布线板10内设置了片状电容器20，所以能够缩短IC芯片90与片状电容器20的距离，降低环线电感。
The IC chip for digit TV receiver through DVB-S channel, is precisely the combination of these advanced technologies. The main work of the paper implements the byte processing part in this chip.
数字电视dVB - S信道接收芯片，正是各种先进技术的结晶，本文完成了DVB - S接收芯片中字节处理环节的研究和实现。
Motor Drive ICs, to be one of the important branches of the applications of SPIC, have symbolized the harmonic combination of the Controlled IC and Power IC within a single chip.
光碟机马达驱动芯片作为功率集成电路的一个重要分支，充分体现了控制集成电路与功率器件在单一芯片上的有机结合。
Fluorescent lighting ballasts-to be one of the important branches of the applications of PIC- have symbolized the harmonic combination of the Controlled IC and Power IC within a single chip.
作为功率集成电路运用的一个重要分支，荧光灯镇流器芯片在其实现上充分体现了控制集成电路与功率器件在单一芯片上的有机结合。
PMM8713 is pulse division IC. This chip converts pulse signal to the signals which decide a stepping motor 'phases to be on or off.
PMM 8713为集成脉冲分配芯片，可将输入脉冲信号分配成一定相序的控制各相通断的脉冲信号。
Samsung Electronics announced that it has developed the industry's first thermally-enhanced chip-on-film (TECOF) package for the display driver IC (DDI) used in large-screen, high-resolution LCD TVs.
三星电子最近宣布，他们发明出了工业界第一个TECOF装置，这能用于大屏幕、高分辨率的LCD电视中的显示器驱动器集成电路（DDI）。
Under pressure of the increase of chip scale and the decrease of timing to market, verification has become the bottleneck of digital IC design.
在芯片规模指数式上升和要求面市时间快速缩短的双重压力下，验证已成为数字集成电路设计的瓶颈。
This article introduces the principle of single chip IC CXA1600 used in AM radio.
介绍调幅收音机单片集成电路CXA1600的工作原理、特点以及应用。
The design of a novel high frequency fluorescent lamp IC, on which low voltage control circuit and high voltage power device encapsulated in one chip, is introduced.
本文介绍了一种高频荧光灯镇流器芯片的设计，在芯片的实现上充分体现了低压控制电路与高压功率器件在单一芯片上的兼容性。
Method of calculation for the non-contact IC card chip coupling power supply and the read and write distance were analyzed, and the relative low-voltage circuit designs were introduced.
分析了非接触式IC卡芯片耦台电源及读写距离的计算方法，并简要介绍了相关低压电路的设计技术。
The top metal test pad, special test mode and BIST are adopted in the IC circuits to solve the IC test problem about the chip function test and electric character test.
通过添加测试引脚、设计专用测试模式，内建自测试等方法有效的解决了该芯片电路的功能测试和电气性能测试。
This paper introduces MSP430 Ultra-Low Power Microcontroller and the ISD4004 chip. A multi-function telephone record system was designed with the two chips and 74c922 keypad encoder IC.
本文以介绍MSP430单片机和ISD4004语音芯片为基础，结合键盘控制器74c922和MSP430的外围设备设计了一台多功能电话留言系统。
Battery over-voltage sensing allows the IC to stand-off up to 50 v, allowing the chip to meet automotive IC load-dump requirements.
电池过电压感测允许IC承受高达50伏特的电压，让芯片可满足汽车IC负载突降要求。
Battery over-voltage sensing allows the IC to stand-off up to 50 v, allowing the chip to meet automotive IC load-dump requirements.
电池过电压感测允许IC承受高达50伏特的电压，让芯片可满足汽车IC负载突降要求。
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