The system include pulse cathodic arc ion deposition, direct current cathodic arc ion deposition, magnetic sputtering and electronic beam evaporation technologies.
该系统集脉冲阴极弧离子镀、直流阴极弧离子镀、磁控溅射和电子束蒸发等镀膜工艺以及气体和金属离子注入于一体。
The system include pulse cathodic arc ion deposition, direct current cathodic arc ion deposition, magnetic sputtering and electronic beam evaporation technologies.
该系统集脉冲阴极弧离子镀、直流阴极弧离子镀、磁控溅射和电子束蒸发等镀膜工艺以及气体和金属离子注入于一体。
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