Black oxidation technology for copper in multilayer printed circuit board was introduced.
介绍了多层印制线路板内层铜墙表面的黑氧化技术。
The fabrication procedure of two kinds of microwave multilayer printed circuit board filled with ceramic particles is briefly introduced.
简单介绍两种陶瓷粉填充微波多层印制板的制造工艺流程。
An automatic routing program system for the wiring of multilayer printed-circuit backplanes is presented in this paper.
此文介绍一个多层印制底板自动布线程序系统。
An automatic routing program system for the wiring of multilayer printed-circuit backplanes is presented in this paper.
此文介绍一个多层印制底板自动布线程序系统。
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