The optimum bonding process was given.
确定了最佳粘接工艺。
The model and the simulation results can be the reference in design of bonding process.
这一模型和模拟结果对硅-硅直接键合设计有一定参考价值。
Psychology lays a foundation for the action process of emotional bonding.
情感担保的作用过程有其心理学基础。
Psychology lays a foundation for the action process of emotional bonding.
情感担保的作用过程有其心理学基础。
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