The interface initial debonding location problem was studied through the push down test.

通过双材料受压试验研究了弱奇异性界面端的界面初始脱粘点的位置问题。

youdao

The interface initial debonding location problem was studied through the push down test.

通过双材料受压试验研究了弱奇异性界面端的界面初始脱粘点的位置问题。

youdao