Two lead frame (strip) vertical or parallel loading function.
双导引结构，垂直或水平装载功能。
Gold, silver and nickel plating of IC lead frame and package shell.
集成电路引线框架、封装壳体的镀金、镀银、镀镍、镀锡工艺。
The invention provides a lead frame and packaging of a semiconductor device.
本发明提供一种半导体器件的引线框及封装。
This results that the lead frame and the detection element have improved electrical connection.
这导致引线框架和检测元件 之间的具有改善的电连接状态。
This results that the lead frame and the detection element have improved electrical connection.
这导致引线框架和检测元件 之间的具有改善的电连接状态。
应用推荐