Solder side is chosen to measure.
量测以吃锡面为选择点。
的锡焊尾，电镀。
以下是一些焊锡照片。
SOLDERABILITY: Wave solder, no wash.
可焊性：波焊，不洗。
Excellent in solder heat resistance.
焊铅锡耐热性优良。
Surface to solder are gold and clean.
待焊接的表面是清洁的金面。
Suit for reflow and wave flow solder.
适应再流焊与波峰焊。
良好的焊锡效果。
Remove rust, scale, paint, solder and more.
除锈，氧化皮，油漆，焊料等。
An ideal connection that puts any solder to shame.
这种理想的连结方式，让其它各类接合方式瞠乎其后。
The third step, the cable soldered to the solder hole.
第三步，把电缆焊接到焊接孔上。
Discuss technology principle of controlling solder oxide.
论述了其抑制钎料氧化技术机理。
The solder pad pinch of the device also decreasing rapidly.
焊球尺寸的减小导致了焊球强度也随之降低。
Before you solder, make sure that the pipes fit together properly.
焊接之前，要确认管子是否般配。
Is the storage fridge temperature of Solder Paste controlled?
是否对存放焊膏的电冰箱温度进行控制？
When the solder flows, remove the iron and let the area cool.
当锡焊料开始流动，移开电烙铁，使该位置降温冷却。
Solder the power wires, positive and negative battery contacts.
焊锡线的力量，积极和消极的电池接触。
Now we can use temporary solder mask to solve all the problems.
现在，我们可以用临时阻焊膜来解决这一问题。
Carefully solder 2 new thin, flexible, insulated wires in place.
小心的将两条细、易弯曲并且绝缘的新导线焊接到位。
Discasses the way of the solder work structure design and notes.
讨论焊接件结构的设计方法及注意事项。
Remove the solder so that there is no contact between the diodes.
除去焊锡，使得两个二极管不接触。
Therefore, it is necessary to study the reliability of this mixed solder joint.
因此，有必要对这种混合焊点进行可靠性分析。
Use only with production equipment specifically designed for use with solder paste.
于专为锡膏设计的设备中使用。
So study lead-free solder paste in the electronic application package is important.
因此研究无铅锡膏在电子封装中的应用具有重要意义。
We will mill, cut, mold solder, program, and draw our way to evaluating product design.
我们将使用磨、切割、焊接铸模、设计程式且推断出自己一套衡量产品设计的方法。
We will mill, cut, mold solder, program, and draw our way to evaluating product design.
我们将使用磨、切割、焊接铸模、设计程式且推断出自己一套衡量产品设计的方法。
应用推荐