• Semiconductor Devices, Physics, and Technology.

    半导体元件物理、物理和技术。

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  • Structure and method are provided for semiconductor devices.

    为半导体器件提供结构和方法。

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  • Thermistors are semiconductor devices whose resistance varies with temperature.

    热敏电阻是一种半导体元件,它的电阻随温度而变化。

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  • Semiconductor devices; metal cases with ceramic insulation, requirements and tests.

    半导体器件。要求和检验。陶瓷绝缘的金属外壳。

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  • Semiconductor devices. Integrated circuits... Part 3: Analogue integrated circuits.

    半导体器件。集成电路。第3部分:模拟集成电路。

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  • Semiconductor devices, called transistors, are replacing tubes in many applications.

    半导体装置也称为晶体管,在许多场合替代电子管。

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  • Semiconductor devices can perform a variety of control functions in electronic equipment.

    半导体器件在电子设备中能起各式各样的控制作用。

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  • The asymptotic behavior of the drift diffusion model for semiconductor devices is studied.

    研究半导体器件的漂移-扩散模型方程解的渐近性。

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  • The reliability of semiconductor devices is very important, especially in space applications.

    半导体器件的可靠性至关重要,?特别是在空间技术应用中尤其如此。

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  • Semiconductor devices. Discrete devices. Part 11: Sectional specification for discrete devices.

    半导体器件。分立器件。第11部分:分立器件分规范。

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  • Semiconductor devices. Discrete devices and integrated circuits. Part 8: field-effect transistors.

    半导体器件。分立器件和集成电路。第8部分:场效应晶体管。

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  • Some comments on the applications of these semiconductor devices in low temperatures are presented.

    并对半导体器件在低温下的应用提出了几点看法。

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  • Many semiconductor devices discussed in the previous chapters can be operated in the microwave region.

    前面几章讨论的许多半导体器件都可以在微波波段运行。

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  • This module introduces the characteristics of semiconductor devices in a range of linear applications.

    这个课程模块介绍了线性放大器范围中的半导体器件的特征。

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  • The present invention relates to methods and structures for the metallization of semiconductor devices.

    本发明涉及半导体器件的金属化的方法和结构。

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  • Semiconductor devices have no filament or heaters and therefore require no heating power or warm-up time.

    半导体器件没有灯丝,因此也不需加热功率或加热时间。

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  • The overall semiconductor devices are mainly used to design high-speed launchers for ultrasonic pulse detection.

    主要采用通用性半导体器件来设计超声检测用高速脉冲发射器。

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  • This way plays a role in the simulation model of technologic process of other power semiconductor devices' dopants.

    此种方法为电力器件其他杂质的扩散工艺过程的模拟提供了一定指导作用。

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  • A novel sparse matrix technique for the numerical analysis of semiconductor devices and its algorithms are presented.

    本文提出了一种用于半导体器件数值分析的新颖的稀疏矩阵技术及其算法实现。

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  • The materials can be made in a variety of morphologies and could be used in semiconductor devices, optics or batteries.

    这种纳米材料可以制成不同的形态,能用于半导体、光学、电池等领域。

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  • The hydrodynamic and the drift-diffusion models are the most widely used models to describe semiconductor devices today.

    在所有描述半导体的数学模型中,流体动力学模型和漂移扩散模型是应用最广泛的模型。

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  • The element is used to harden certain steels, among other metallurgical uses, and is also used in semiconductor devices.

    广泛用于提高钢的淬硬性以及其它冶金工业,也用作半导体。

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  • Spintronics holds great promise for creating circuits that are faster and more energy efficient than standard semiconductor devices.

    自旋电子学在创建更高速、更节能的电路元件方面比标准半导体器件拥有更大的潜力。

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  • The steady state thermal resistance has important influence on the life test by researching the discrete semiconductor devices.

    在进行相关分立器件分析时发现,稳态热阻对功率器件寿命试验结果影响较大。

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  • The reliability of semiconductor devices has become increasingly important in their applications for both civilian and military systems.

    随着半导体器件在民用和军用系统中广泛的使用,器件的可靠性问题研究越来越重要。

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  • This weapon generates a very short, intense energy pulse producing a transient surge of thousands of volts that kills semiconductor devices.

    该武器能在很短时间内产生高能脉冲,并进而产生瞬间数千伏电压聚增以破坏半导体设备。

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  • Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits.

    半导体器件。集成电路。第20部分:薄膜集成电路及混合薄膜集成电路的总规范。

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  • Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits.

    半导体器件。集成电路。第20部分:薄膜集成电路及混合薄膜集成电路的总规范。

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