Electroplating processes of Au, Au-Sn, Sn-Pb, Sn-Ag and chemical nickel-plated bumpings are described in particular. And finally, electroplating equipments for bumping formation are introduced.
着重介绍了电镀金、金锡、锡铅、锡银和化学镀镍凸点的工艺过程，最后简单介绍了制备凸点的电镀设备。
The Bainiuchang Ag deposit is a large Ag-Sn-pb-Zn deposit discovered and explored in recent years.
白牛厂银矿是近年发现探明的一大型银锡铅锌矿床。
The associated gold mineralization can be classified into two types: Au (Ag) -bearing polymetallic skarn sulphide Sn-Cu deposit and Au-be.
伴生金矿床可分为含金(银)多金属矽卡岩硫化锡铜矿床及含金脉(层)状锡铅矿床。
The Shanghai economic district is rich in mineral resources of following varieties: mainly Cu, Pb, Zn, W, Sn, Mo, Mn, Au, Ag, REE, Nb and Ta.
上海经济区蕴藏着丰富的金属矿产资源，主要有铁、铜、铅、锌、钨、锡、钼、锰、金、银、稀土、铌、钽等矿种。
Properties and preparing process of tri layer films with Ag base coating, Ni electrodeposit, Sn Pb alloy for terminal electrode of multilayer chip inductor were described.
介绍了叠层片式电感三层端头电极即银基底电极、镍层、锡-铅合金镀层的性能及制备工艺。
The Sn, Pb, and Ag anomalies delineated with the technology have been identified by trenching.
利用该技术圈定的异常，经探槽揭露证实为矿化异常。
Choi S. Lee J. Guo F Creep properties of eutectic SnAg solder and Sn- Ag composite solders containing intermetallic particles.
史耀武。闫焉服。刘建萍金属颗粒增强的锡铅基复合钎料及其制备方法。
The physical properties, solderability, mechanical properties and the creep-rupture life of the nanon-sized Ag particles reinforced Sn-37Pb composite solder were investigated.
研究了纳米银颗粒增强锡铅基复合钎料的物理性能、工艺性能、力学性能和蠕变性能。
According to the historical materials, the famous Gejiu Sn deposit was first exploited for Ag(Pb) Zn ore at Yindongkuang of Laochang orefield in 1290.
著名的个旧锡矿，据史料在元廿七年（12 90年） ，率先在老厂矿区银铜矿开始采银（铅）锌矿。
According to the historical materials, the famous Gejiu Sn deposit was first exploited for Ag(Pb) Zn ore at Yindongkuang of Laochang orefield in 1290.
著名的个旧锡矿，据史料在元廿七年（12 90年） ，率先在老厂矿区银铜矿开始采银（铅）锌矿。
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