Research progress of lead-free solder, invalidation models of solder joint, solder joint reliability evaluation and the defects of solder joints in recent years have been reviewed.
笔者就近年来国内外开发的无铅焊料、焊点的失效模式、焊点可靠性评价方法和焊点的主要缺陷进行了综述；
Analyse the failure modes and mechanism of the mixed solder joint, and introduce the effect factors of reliability ulteriorly.
对混合焊点的失效形式和混合焊点的失效机理进行了分析，并进一步介绍了影响这类焊点可靠性的因素。
So the drop impact reliability of solder joint is the key content of unleaded portable electronic products.
因此，焊点跌落可靠性是无铅便携式电子产品可靠性的关键内容。
In the microelectronic packaging, the reliability of the solder joint has been being a forward position and a hot topic.
电子封装中的的焊点可靠性问题一直是电子封装中学科的前沿和热点问题。
Therefore, it is necessary to study the reliability of this mixed solder joint.
因此，有必要对这种混合焊点进行可靠性分析。
The orthogonal experiment design method was applied to study the relationships between solder joint process parameters and reliability of plastic ball grid array (PBGA) component.
基于正交试验设计法对塑封球栅阵列(PBGA)器件焊点工艺参数与可靠性关系进行了研究。
For increased reliability, a reduced CTE (coefficient of thermal expansion) mismatch with the PCB reduces the possibility of solder-joint cracks resulting from thermal cycles.
为提高可靠性，降低的热膨胀系数(热膨胀系数)的不匹配与PC B减少了从热循环所得的焊点的裂缝的可能性。
For increased reliability, a reduced CTE (coefficient of thermal expansion) mismatch with the PCB reduces the possibility of solder-joint cracks resulting from thermal cycles.
为提高可靠性，降低的热膨胀系数(热膨胀系数)的不匹配与PC B减少了从热循环所得的焊点的裂缝的可能性。
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