The text on the two solder mask layer is same, we will cancel the text that on this solder mask layer, please refer to Q9.
此层上的字符与另一层绿油上的字元相同，请确认是否可以取消此层上的该字符。请看Q9处。
The text on the solder mask layer is overlapping the text that on the circuit layer. We suggest move it away. Please refer to Q7.
绿油层上的字符与线路上的字符重叠在一起，建议将绿油层上的字符移开。请看Q7处。
Please see below picture, those letters overlap at circuit layer and solder mask. We suggest deleting the letters in solder mask layer.
如图，那些字在线路和阻焊层都有，我们建议删除阻焊上的字。
The solder mask layer is formed on the flexible dielectric layer to locally cover the pins and to cover or expose the reinforced metal patterns according to different application.
该防焊层形成于该可挠性介电层上，以局部覆盖该些引脚，并依不同应用可覆盖或显露该补强金属图案。
A semiconductor package substrate for preventing deformation mainly comprises a flexible dielectric layer, a plurality of pins, at least one reinforced metal pattern and a solder mask layer.
一种改善变形的半导体封装基板，主要包括一可挠性介电层、多数个引脚、至少一补强金属图案以及一防焊层。
The circuit board comprises a dielectric layer, a circuit layer and at least one electricity-conducting joint pole and a solder mask.
一种电路板，其包括介电层、线路层、至少一导电接合柱与焊罩层。
The solder mask is configured on the dielectric layer and covers the circuit layer.
焊罩层配置在介电层上且覆盖线路层。
The solder mask is configured on the dielectric layer and covers the circuit layer.
焊罩层配置在介电层上且覆盖线路层。
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