The solder pad pinch of the device also decreasing rapidly.
焊球尺寸的减小导致了焊球强度也随之降低。
When the first signal defect is produced, make the signal-exerting solder pad mutually short-circuit.
在产生第一信号缺陷时，使所述信号施加焊盘相互电短接。
The effects of bending support span, solder pad size, reflow and aging history on PCB bending reliability are discussed.
讨论了弯曲跨距、焊盘尺寸等参数、以及焊点所经历的回流、老化等热过程对PC B焊点弯曲可靠性的影响。
The wider track provides better impedance matching at solder pad interfaces and provides better immunity to PCB manufacturing process variations.
更宽的线在焊盘接口提供更好的阻抗匹配、为PC B柔性加工过程提供更好的豁免权。
The static protecting line connects between the first virtual solder pad and the second virtual solder pad having a charge inducting pad which is exposed at surface of the flexible loader.
静电防护线连接于第一虚设焊盘与第二虚设焊盘之间并通过 印刷电路板连接至接地端或电源端，且静电防护线上具有电荷导入垫，其暴露于软性承载器表面。
The second technique involved using braided solder wick and a soldering iron with a blade tip to remove residual solder from the PCB pad.
第二个技术工艺涉及到使用网状焊料芯吸法及有刀片尖的焊接烙铁来除去PC B焊盘上的残余焊料。
The results show that the instantaneous temperature of solder droplet when it reached the pad is mainly determined by the initial temperature.
结果表明：对钎料熔滴到达焊盘瞬时的接触温度，熔滴初始温度是其主要影响因素，而高度变化对其影响不大。
If this bump is soldered to the pad on a packaging substrate, solder gets wet in the whole region of the columnar bump upper surface and only a part of the side surface.
如果这个块焊接至布线基板上的焊盘，焊料将沾湿于柱状块上表面整个区域，和侧表面的部分区域。
If this bump is soldered to the pad on a packaging substrate, solder gets wet in the whole region of the columnar bump upper surface and only a part of the side surface.
如果这个块焊接至布线基板上的焊盘，焊料将沾湿于柱状块上表面整个区域，和侧表面的部分区域。
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