In the last two years, Electroglas has made major new technology introductions for 200mm and 300mm wafer probing and final test handling.
在过去的两年中，伊智主要为200mm和300 mm晶圆探针台和封装测试处理引入了新的技术。
A perforated metal wafer carrier is also used for wafer bonding for easy handling and de-bonding.
穿孔金属晶片载体也用于晶片键合，用以容易地处理以及松解。
A perforated metal wafer carrier is also used for wafer bonding for easy handling and de-bonding.
穿孔金属晶片载体也用于晶片键合，用以容易地处理以及松解。
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