The results show that the current decays rapidly at early stage during anodic bonding and then decreases slowly;
本文结果表明，连接初期电流迅速衰减，随后缓慢变小，直至某一稳定值；
The stress of anodic bonding is analysed and the math model of no match thermal stress about anodic bonded elastic diaphragm is built.
通过对静电封接结构的受力分析，建立了静电封接后弹性膜片的热失配应力数学模型。
Under the assumption of only tow kinds of mobile alkali ions in glass, a model for the metal glass electric field assisted anodic bonding is proposed.
在假设玻璃中仅有两种可动碱金属离子的情况下，提出了一个金属玻璃电场辅助阳极连接模型。
This paper investigates one kind of micro heat pipe arrays (MHPA), which are fabricated by advanced silicon bulk micromachining and anodic bonding technology.
介绍了一种基于硅体加工技术以及阳极键合技术的微热管阵列。
The intimate contact of two surfaces to be bonded is a prerequisite for the anodic bonding, therefore, it is very important to analyze evolution characters of the intimate contact area.
待连接表面间的紧密接触是实现阳极连接的必要条件，因此分析紧密接触面积演化特点非常重要。
Effects of point cathode anodic bonding are theoretically investigated by using electrical circuit analog. The bonding current, incubation period and intimate contact area are calculated.
用等效电路的方法研究了点阴极情况下的电场辅助阳极连接效应，计算了连接电流、连接孕育期和紧密接触面积。
Finally experiments of anodic bonding and Au-Si bonding have been carried out to find out the key factors related to the bonding strength, and the most feasible bonding manners are put forward.
最后，进行了阳极键合、金-硅键合试验，研究了试验中影响键合强度的关键因素，提出了较为可行的键合工艺。
Anodic bonding is a new way to realize the bonding between solid electrolyte glasses (ceramics) and metals through the interaction process of electricity and heat.
阳极键合是一种利用电和热相互作用实现固体电解质玻璃(陶瓷)与金属材料固态连接的一种新方法。
A tunneling accelerometer is fabricated and characterized based on the extension of the silicon-glass anodic-bonding and deep etching releasing process provided by Peking University.
提出了一种基于北京大学硅玻璃键合深刻蚀释放工艺的扩展工艺，用来加工微型隧道加速度计。
A tunneling accelerometer is fabricated and characterized based on the extension of the silicon-glass anodic-bonding and deep etching releasing process provided by Peking University.
提出了一种基于北京大学硅玻璃键合深刻蚀释放工艺的扩展工艺，用来加工微型隧道加速度计。
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