Conclusion: The chemical polishing of titanium has a clinical applying value, and is worth of spread.
结论：纯钛铸件的化学抛光法具有临床应用和推广价值。
Must do derusting and to oxidation film processing, generally use chemical polishing or electrolytic polishing.
必须先做除锈及去氧化膜处理，一般使用化学抛光或电解抛光。
This paper focuses on the study of the solution and process for alkaline chemical polishing aluminum and its alloy.
主要研究了适合铝及铝合金的碱性化学抛光液及抛光工艺。
The technics of chemical etching, chemical polishing and chromium electroplating for stainless steel mould were studied.
研究了不锈钢模具板的化学蚀刻、化学抛光和电镀铬工艺。
The technics of chemical etching, chemical polishing and chromium electroplating for stainless steel mould were studied.
采用化学蚀刻法测定了氚在不锈钢材料中的纵向分布。
The solution composition and technological parameters of chemical polishing of stainless steel at room temperature were studied.
本文研究了不锈钢室温化学抛光液的组成和工艺参数。
Super-thick oxide films on copper and copper alloy parts heat-treated at high temperature make it very difficult for chemical polishing of the parts.
铜及铜合金制品经高温氧化后氧化皮过厚，进行化学抛光处理难度较大。
The aluminum often needs to carry on chemical polishing processing before the electrolytic oxidation, increases its surface smooth finish and the radiance.
铝件在电解氧化前往往需要进行化学抛光处理，以增加其表面光洁度和光亮度。
The technics can been applied to surface treatment of chemical etching, chemical polishing and chromium electroplating for different kinds of stainless steel.
该工艺可以用于各种类型不锈钢的化学蚀刻、化学抛光和电镀铬处理。
Changes in specular reflectivity, weight loss, surface topograph and potential with time and current-potential curves during chemical polishing were determined.
测定了化学抛光过程中紫铜的表面光反射率、失重、表面形貌和电位随时间的变化以及抛光过程的电流-电位曲线。
An environmentally-friendly chemical polishing and passivation process was established for copper and its alloys, using a rare earth salt in the passivation solution.
为了提高铜及其合金的表面抗变色能力，研制了一种环保的化学抛光工艺和含稀土盐的新型钝化工艺。
This paper studies the technology of stainless steel chemical polishing under low temperature and introduces the functions of partial components in polishing solution.
研究了不锈钢在低温条件下的化学抛光工艺。
In this paper mechanical polishing; Chemical polishing and hydrogen reduction methods used im cleaning bearing steel surface for oxygen determination have been studied.
本文研究了用机械抛光、化学抛光和氢还原法处理轴承钢表面对测定氧的影响。
According to the faults of common stainless steel chemical polishing agent, a formulation of green chemical polishing agent for stainless steel with high performance was studied.
针对常规不锈钢化学抛光剂的缺点，研制出了一种高性能环保不锈钢化学抛光剂配方。
A new technology for chemical polishing of copper in weak alkaline solution has been developed and a brightener (containing corrosion inhibitor and surfactant) has been found out.
开发出了弱碱性溶液中紫铜化学抛光新工艺，确定了抛光液中的光亮剂(包括缓蚀剂和表面活性剂)。
Uses: used as glass etching agent, metal surface of the chemical polishing agent, wine of the disinfectant, preservative, mordant the fiber is also used for extraction of rare elements and so on.
用途：用作玻璃蚀刻剂，金属表面的化学抛光剂、酿酒的消毒剂，防腐剂，纤维的媒染剂，也用于提取稀有元素等。
A complete bright silver plating process for deluxe tableware including chemical polishing, mechanical polishing, degreasing, cleaning, nickle plating, silver plating and post-treatment is suggested.
介绍餐具光亮镀银的全套实用工艺，包括化学抛光、机械抛光、除蜡、除油、镀镍、镀银、以及镀后处理等。
The affections of different surface treatments by mechanical polishing, chemical etching and photoetching to the properties of electrodes have also been discussed.
探讨了机械抛光、化学抛光和光抛光等不同表面处理方法对电极特性的影响。
Chemical-Mechanical % polish (CMP) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing. It is used during the fabrication process.
化学-机械抛光(CMP) -平整和抛光晶圆片的工艺，采用化学移除和机械抛光两种方式。此工艺在前道工艺中使用。
With these spectral methods, the chemical composition and the structure of the polishing paste for plastics were identified.
通过上述光谱法确定了该塑料抛光膏的化学组成和结构。
The mechanism of W-CMP was analyzed, the slurry makes a dual function of chemical erosion and mechanical lapping, has an important influence on the polishing rate.
分析了W -CMP的机理，抛光液对W材料表面具有化学腐蚀和机械研磨的双重作用，对抛光速率有着重要的影响。
Typical chemical mechanical polishing (CMP) of copper layers on semiconductor devices involves using a hard pad in the first step and a soft pad for the barrier layer removal step.
半导体器件上铜层化学机械抛光(CMP)的第一道工序一般需要使用一块硬抛光垫，在磨去阻挡层的工序中要用到软垫。
Chemical-Mechanical polish (CMP) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing. It is used during the fabrication process.
化学-机械抛光(CMP) -平整和抛光晶圆片的工艺，采用化学移除和机械抛光两种方式。此工艺在前道工艺中使用。
This air grinder is used for burr clearing, sanding, polishing, roll scale thining and welding in working ship, chemical machinery, mechanism manufacture repairing and working and so on.
该气砂轮在船舶锅炉、化工机械及各种机械制造和维修工作中，用于清除毛刺和氧化皮修磨焊缝、砂光、抛光等作业。
Polishing pad conditioning is very important for chemical mechanical polishing to improve the performances of a pad.
抛光垫修整是化学机械抛光的重要过程之一。
Chemical Mechanical Polishing(CMP); abrasive particle; modeling; wafer;
机械化学抛光；磨粒；建模；芯片；
In Chemical-Mechanical polishing experiments we produced optical quality super smooth surfaces on single-crystal silicon, but cannot insure the surface figure.
使用机械 -化学抛光法加工大尺寸单晶硅可获超光滑表面 ，但很难保证良好的面型。
This air grinder is used for burr clearing, sanding, polishing, roll scale thinning and welding in working ship, chemical machinery, and mechanism manufacture repairing and working and so on.
该气砂轮在船舶锅炉、化工机械及各种机械制造和维修工作中，用于清除毛刺和氧化皮修磨焊缝、砂光、抛光等作业。
A chemical mechanical polishing pad comprising a water-insoluble matrix which comprises (a) a styrene polymer and (b) a diene polymer.
一种化学机械抛光垫，包含由(A)苯乙烯聚合物和(B)二烯聚合物构成的非水溶性基质。
Polishing pad is a very important component of the chemical-mechanical polishing (CMP) system.
抛光垫是化学机械抛光(CMP)系统的重要组成部分。
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