To determine the parameters required in calculation, the two-specimen DWTT method is deducted to determine the heat dissipation rate formula.
为了给出计算需要的参数，推导了双试件DWTT法测定热耗散比率的公式。
The numerical and analytic results show that the heat transfer rate obtained by potential capacity dissipation minimization is better than that by entropy generation minimization.
数值计算和理论分析的结果表明，根据最小传递势容耗散原理得到的结果优于最小熵产原理得到的结果。
As the demand increasing steadily for small volume, high density and high heat-dissipation rate IC, the key parameter of wire bonding — pad pitch has to shrink in accordance.
由于市场对小体积、高集成度和高散热率芯片的需求量与日俱增，引线键合工艺的关键参数——焊盘间距也不断缩小以满足市场要求。
As the demand increasing steadily for small volume, high density and high heat-dissipation rate IC, the key parameter of wire bonding — pad pitch has to shrink in accordance.
由于市场对小体积、高集成度和高散热率芯片的需求量与日俱增，引线键合工艺的关键参数——焊盘间距也不断缩小以满足市场要求。
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