Chipset heatsink not detected.
未侦测到晶片组散热器。
未检测到散热器。
Q1将需要一个散热器。
That means high idle current and big heatsink.
这意味着很高的静态电流和很大的散热器。
Material:Metal Base, Stainless Steel Bracket , Aluminum Heatsink ;
材料：金属底座，不锈钢背板，铝合金头。
Furthermore, we also offer a complete range of SSR's with a built-in heatsink.
此外，我们还提供了对SSR的齐全与一个内置的散热片。
I can't think of a single recently released heatsink that's made in North America.
我想不出一个最近发表的散热器是在北美洲。
Enclosure has no vent opening. Enclosure dimensions exclude the external aluminum heatsink.
外包装没有通风口。外包装尺寸并不包括外置铝散热片。
For the first tests, I used 6 mm thick aluminum for the CPU-block and the connections to the heatsink.
第一次测试中，我用6毫米厚的铝的CPU块及对散热片的连接。
In this paper the coupling capacitance between the heatsink and the devices is calculated by FDTD method.
所以本文提出了采用FDTD法计算散热片与器件间的高频耦合电容的构想。
These set points, represented in Table 1 and Figure 1 can vary by a few degrees from fan heatsink to fan heatsink.
这些设定点，如表1和图1所示，对于不同的风扇散热器可以有几度的差异。
Using such devices will likely damage the processor and socket, and may cause improper operation of the heatsink fan.
使用这类装置可能损坏处理器和插座，并可能造成散热器风扇运行不正常。
A simple evaluation of the temperature of the heatsink base can provide confidence in the system's thermal management.
对散热器基座温度的简单测量可以为系统热量管理提供信心。
Systems should be designed to provide air around the boxed processor fan heatsink that remains below the lower set point.
系统应该设计为使盒装处理器风扇散热器周围空气温度保持在设定点的下限以下。
It is important to understand the impact of factors related to the interface between the processor and the heatsink base.
很重要的一点就是要理解处理器和散热器基座间接口的相关因素的影响。
The boxed processor fan heatsink uses a variable speed fan that increases in speed as the air temperature entering the fan increases.
盒装处理器的风扇散热器采用了一种变速风扇，它可以随着进入风扇的空气温度的升高而提高转速。
However, in some situations, it may be necessary because of excessive dust and dirt buildup within the computer, such as on the processor's heatsink.
但是，在某些情况下，它可能是必要的，因为过多的灰尘和污垢堆积在处理器的计算机，例如在。
According to the automated weld requirement on the rowing welding machine of refrigerator heatsink of a factory, the mechanism of the feeding system was designed.
根据某厂电冰箱散热器排焊机的自动化焊接要求，对散热器焊接进给系统进行了机构设计。
Features:Using quality alum heatsink for excellent heat dissipation. lnnocative lighting with ultra slim and lightweight profile. No UV/IR, low heat and long lifetime.
产品特点：铝合金外壳高档美观发热量底，超长使用寿命，没有紫外线及红外线辐射。低压供电稳定安全。
Because the LED modules will be used outside, they will need to consider practical environmental factors, such as the possibility of birds nesting over a vital heatsink.
由于LED模块会被用在户外，所以需要考虑实际的环境因素，如关键的散热片上被鸟筑巢的可能性。
Table 1 contains the recommended temperature that the heatsink base test point or the air inlet temperature should remain below during the thermal evaluation of a system.
表1含有进行系统热量测量时散热器基座测试点或空气入口温度应该低于的推荐温度值。
Based on the analysis, the heat sink materials, cooling liquid, the heatsink structure, and the bonding of laser bar are optimized in order to increase the transfer efficiency.
通过分析，对微通道热沉材料、冷却液、微通道热沉的结构参数以及热沉与激光器列阵条的封装等进行了优化设计。
System integrators should design systems that ensure that the air temperature around the boxed processor fan heatsink is kept below the lower set point for the lowest noise level.
系统集成商设计系统时，应该使盒装处理器风扇散热器周围空气温度保持在最低设置点之下时，保证风扇在最低噪音下工作。
The maximum acceptable junction temperature is different for C and I grade devices. If it is higher than the max. acceptable temperature, you may consider adding a heatsink or cooling fan.
C和I级器件允许的最高接合温度不同。如果温度高于允许的最高值，可能需要增加散热片或风扇。
In addition, the processor's fan heatsink clip may be difficult or impossible to install correctly, potentially causing fan failure and improper operation, which would void the processor warranty.
此外，处理器的风扇散热器夹具可能难以或不能正确安装，并潜在地引起风扇故障和不正常运转，使处理器保修失效。
Coupling capacitance between the heatsink and the devices produces common mode emission, which is considered as a constant calculated by a equation resulting from the static field for a long time.
散热片与器件间的电容耦合是电路产生共模辐射的主要原因之一，其对研究电路的辐射发射特别重要。然而长期以来人们将该电容简化为平板电容，采用静电场推导的电容公式计算。
Coupling capacitance between the heatsink and the devices produces common mode emission, which is considered as a constant calculated by a equation resulting from the static field for a long time.
散热片与器件间的电容耦合是电路产生共模辐射的主要原因之一，其对研究电路的辐射发射特别重要。然而长期以来人们将该电容简化为平板电容，采用静电场推导的电容公式计算。
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