Each sculptural planter is made-to-order with handmade glass and lead-free solder and comes with everything you need but the plants.
每个艺术花盆都是定制的。它们由手工制作的玻璃和无铅焊料接合而成，交付使用时，万事俱备，只欠花卉。
Therefore, electroplating of lead-free solder coating is one of investigation hotspots in electronic electroplating field.
因此，电沉积无铅可焊性镀层是电子电镀领域的研究热点之一。
Through the strict implementation of lead-free technology, we will continue to improve our product quality and continue to meet customer demand.
通过严格执行无铅工艺，我们将持续提高我们的产品品质，一如既往地满足客户的需求。
Due to the consideration of environmental protection, the substitution of lead-containing solder with lead-free solder has become an inevitable trend in the 21st century.
进入21世纪，由于环境保护的要求，锡铅焊料将逐步被无铅焊料所取代。
The solder alloys especially the lead-free solder alloys become the focus of study because of the quick development of the microelectronics and the surface mount technology (SMT).
随着微电子表面组装技术的迅猛发展，软钎料尤其是无铅钎料逐渐成为研究的焦点。
Generally the same fluxes will work for lead-free solder.
一般来说，相同的焊剂用于无铅焊料是有效的。
Through research, choose one or two lead-free solder paste.
通过研究，选择一种或两种无铅锡膏。
At last, the progress trend of lead-free solder is pointed out.
最后指出了无铅焊料的发展趋势。
You should not have to change your stencil design to accommodate the change to lead-free.
您不需要为更换无铅锡膏而更改钢板设计。
UL testing may be required to produce and assemble boards with lead-free surface finishes.
生产和装配经过无铅表面处理的线路板，可能需要进行UL测试。
Nitrogen Protection is used in practical industry because of poor wettability of lead-free solder.
由于无铅钎料润湿性较差，在实际生产中普遍采用氮气保护。
The prime driving force adopting lead-free technology is the legislation and marketing advantage of green products.
环境法规及市场对绿色产品的需求，是采用无铅生产技术的主要动力。
BNKLT lead-free piezoelectric ceramics invented in authors' group were used for making middle frequency ceramic filters.
采用本组发明的BNKLT系无铅压电陶瓷，研制了中频陶瓷滤波器。
The disadvantages of three typical lead-free solders, and three problems in the conductive adhesive study are discussed.
文中介绍了三种典型无铅焊料体系的不足之处，以及银导电胶研究中的三个难题。
Development and application of lead-free piezoelectric ceramics have become the concern of scientists of many countries.
无铅压电陶瓷的开发和应用已经成为各个国家的研究热点。
In combination of our recent results, the current status and prospect on lead-free solders has been introduced in detail.
结合我们的研究成果，详细介绍了无铅钎料开发的现状及前景。
In combination of the recent results, the current status and prospect on lead-free solders has been introduced in detail.
结合目前的研究成果，详细介绍了无铅钎料开发的现状及前景。
Current status and trend of lead-free technology have been reviewed for electronic assembly manufacturing at home and abroad.
论述了国内外电子组装生产中无铅技术的现状及发展趋势。
This lead-free fuel requirement, in turn, significantly reduces the amount of lead (and other metal additives) in the atmosphere.
这种对无铅燃料的要求相应也显著地减少了大气中的铅含量(和其他金属附加物)。
The preparation method of lead-free piezoelectric ceramic is the key factor to determine its structure, character and application.
无铅压电陶瓷的制备方法是决定其结构、性质和应用的关键因素。
It is unavoidable that lead-free solders are applied in SMT field in view of the environmental protection and the competitive motivation.
无论是环境的要求还是作为竞争的筹码，无铅钎料在表面组装领域中的应用已经是不可回避。
Many electronics manufacturers will transition their soldering processes from traditional tin-lead alloys to lead-free alloys before 2006.
许多电子制造商将在2006年前从传统的锡铅合金钎焊工艺改变为无铅合金的钎焊工艺。
The results showed that the lead-free PTC composites which had the size distribution of 30 ~ 70nm could be prepared by citrate sol-gel method.
实验结果表明：利用柠檬酸盐溶胶凝胶法可以合成颗粒粒径在30 ~ 70纳米的无铅ptc陶瓷粉体。
This paper reports the development and the application detail of cobalt-free, lead-free and environmentally friendly exhaust valve seat insert.
这篇论文详细报道了无钴、无铅及有利于环境的排气阀座圈的开发与使用。
Which lead-free wave soldering , lead-free reflow after several years of research and development, has now reached international advanced level.
其中无铅波峰焊、无铅回流焊经过几年研究开发，目前已达到国际先进水平。
It covers the background, solders, surface finishes, components, substrates, assembly processes, rework, and reliability of lead-free soldering.
包括背景，焊料，表面镀层，元器件，基板，组装工艺，返工和无铅焊接的可靠性。
The results indicated that small amount of high melting point metals had less than 2% effect on melting properties of previous lead-free solders.
结果表明，添加微量高熔点金属对焊料的熔融特性影响小于2%。
Solders are the main join materials in the electronic - packaging and now lead-free solders are used in the electrical products on a large scale.
在电子封装中焊料是主要的连接材料，现在无铅焊料已经普及并大规模应用在实际电子产品中。
The main products are: solder wire, lead-free solder bar, line, lead-free solder paste, strips, tin ingots, flux, electroplating anode, babbitt, etc.
主要产品有：焊锡丝、焊锡条、无铅锡线、无铅锡条、锡膏、锡锭、助焊剂、电镀阳极棒、巴氏合金等。
The main products are: solder wire, lead-free solder bar, line, lead-free solder paste, strips, tin ingots, flux, electroplating anode, babbitt, etc.
主要产品有：焊锡丝、焊锡条、无铅锡线、无铅锡条、锡膏、锡锭、助焊剂、电镀阳极棒、巴氏合金等。
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