A passivation layer assembly and a display substrate having the same are presented.
本发明提供了一种钝化层组件以及具有该钝化层组件的显示基板。
The passivation layer (18) is patterned to form a first opening (20) to contact the last interconnect layer (16).
该钝化层(18)被图案化以形成第一开口(20)以接触最后的互连层(16)。
Both a passivation layer (18) and a polyimide layer (22) separate the last interconnect layer (16) and the bond pad (28).
钝化层(18)和聚酰亚胺层(22)将最后的互连层(16)和接合焊盘(28)隔开。
Simultaneously, defects in the passivation layer of the device surface are also increased with the increasing of the baking temperature and also the surface recombination velocity.
同时芯片表面钝化层内的缺陷数目也在温度作用下增加，引起芯片表面复合速度增加。
The new sulfur passivation technique developed in late 80's injects new life into the study of the passivation although the chemical stability of the passivation layer is not so satisfactory.
八十年代后期出现的硫钝化技术给钝化研究注入了活力，但它的化学稳定性仍不够理想。
The new sulfur passivation technique developed in late 80's injects new life into the study of the passivation although the chemical stability of the passivation layer is not so satisfactory.
八十年代后期出现的硫钝化技术给钝化研究注入了活力，但它的化学稳定性仍不够理想。
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