• Two dangling stars, one in Silver Shade crystal and the other in gold plating, add extra sparkle.

    分别垂挂着银色魅影水晶星星和镀金色星星。

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  • Bright silver plating processes for different substrates as well as formulae are given.

    介绍在不同基体上电镀银的工艺及其配方。

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  • Silver plating provides the best possible connection, regardless of plating on the equipment jacks.

    不论所要电镀之接头器材为何,镀银方式是最佳的连接方式。

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  • Metal components and pins can be in different plating like silver, 24k gold, platinum.

    金属件及插脚均可镀上不同镀层,如银,24K金,铂金等。

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  • A method for autocatalytic plating of silver metal directly onto a silicon surface without the need for an intervening layer of metal is also disclosed.

    还公开了在不需要金属中间层的情况下,直接在硅表面上自催化镀覆银金属的方法。

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  • The MH electrode was modified with a thin silver film using vacuum evaporate plating technology.

    采用真空蒸镀的方法对贮氢合金电极进行了镀覆银膜的表面修饰。

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  • Silver plating color variation affects not only its outlook but also its electricity conductibility.

    银镀层变色不仅影响镀层的外观,更重要的是影响镀层的导电性能。

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  • Ni B plating possesses good weldability and conductivity, and the electrode loss is lower than that of silver electrode. It may be used instead of silver plating.

    镀层具有良好的可焊性和导电性,其电极损耗低于银电极损耗,可作为代银接触镀层。

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  • In this paper, the silver coated aluminum powder which had good electric property and stable property was produced by twice electroless plating.

    本文利用双重化学镀的方法成功的获得了导电性优良、性能稳定的镀银铝粉。

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  • In order to obtain better conductive functional filler and conductive adhesive, the surface of carbon nanotube (CNT) was wrapped by silver using chemical plating.

    采用化学镀法在碳纳米管表面包覆金属银,从而获得了导电性极好的纳米银-碳复合管,并以该复合管为导电功能体制备导电胶。

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  • Silver-copper powder was prepared by plating silver on micron sized copper powder, its properties were examined, and the test results obtained were then analyzed in this discussion.

    采用化学沉积法在微米级铜粉上镀银,并对得到的镀银铜粉的性能进行测试,对得到的结果进行了分析。

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  • The process formula of acid bright copper plating, acid bright nickel plating, (silver) plating and various colour gold plating on fresh flowers were presented.

    并给出了鲜花上酸性光亮镀铜、酸性光亮镀镍、镀银以及镀各种彩色金的工艺配方。

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  • The reflectivity of the layer on the distal end of the optical fiber is measured indicating that the reflectivity of the electroless silver plating layer is high.

    对光纤端面镀层光反射率的测量表明,化学镀银层的光反射率较高。

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  • The effect of process conditions of electroless copper plating on resistivity of silver coated nickel powder was discussed.

    探讨了化学镀铜工艺条件对银包镍粉电阻率的影响。

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  • Effects of time, order of adding reagents, contents of ethanediol, silver nitrate, acid copper plating bath and nitrate on scattering intensity of resonance light were studied.

    讨论了乙二醇用量、硝酸银用量、酸性镀铜液(底液)用量、硝酸用量、时间及试剂加入顺序对共振光散射强度的影响。

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  • An autocatalytic electroless plating bath for coating silver metal is also described.

    还公开了涂布银金属用的自催化的无电镀覆浴。

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  • Successful tests on the silver plating on hard aluminium, pure aluminium and rust-proof aluminium alloy, are made and the mass production is finally carried out.

    对硬铝、纯铝、防锈铝合金镀银进行了试验并获得成功,投入了批量生产。

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  • Through electroless plating carbon nanotubes were coated with a continuous layer of silver, which will increase interfacial strength between carbon nanotubes and metal-matrix.

    通过化学镀可在碳纳米管表面镀上一层连续的银镀层,以增强碳纳米管与金属基体的界面结合力。

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  • A complete bright silver plating process for deluxe tableware including chemical polishing, mechanical polishing, degreasing, cleaning, nickle plating, silver plating and post-treatment is suggested.

    介绍餐具光亮镀银的全套实用工艺,包括化学抛光、机械抛光、除蜡、除油、镀镍、镀银、以及镀后处理等。

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  • Ten typical formulas and some kinds of additives used for cyanide-free silver plating were introduced.

    综述了十种典型的无氰镀银工艺配方和无氰镀银所采用的添加剂类型。

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  • With bright nickel strike plating before pulse non-cyanide silver plating, brighter and finer silver coatings with stronger anti-tarnish property and corrosion resistance can be obtained.

    光亮镍打底后再脉冲无氰镀银,可获得更加光亮、结晶细致的镀银层,且抗变色性能及耐蚀性均增强。

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  • The stainless steel matrix was dipped in a solution containing palladium and silver ions to prepare palladium-silver membrane by electroless plating.

    无电解镀共沉积钯银合金膜是纯化氢同位素最有发展前途的方法之一。

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  • The optimal scheme was ascertained as flows: alkaline wash-diluted hydrochloric acid activation-acidic copper plating-replacement silver plating.

    确定了最佳方案:碱洗—稀盐酸活化—酸性镀铜—置换法镀银。

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  • Pretreatment, silver plating, nickel plating and tin plating of chip components.

    应用于片式元器件的前处理、镀银、镀镍、镀锡等工艺。

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  • Semi-automatic rolling copper, nickel, silver, zinc, tin, etc. and electroless nickel plating.

    半自动滚镀铜、镍、银、锌、锡及无电解镀镍等。

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  • The development tendency and characteristics of electroless silver plating on non-metallic powders were introduced.

    介绍了非金属粉体化学镀银的发展趋势和特点。

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  • The development tendency and characteristics of electroless silver plating on non-metallic powders were introduced.

    介绍了非金属粉体化学镀银的发展趋势和特点。

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