Printed circuit board, Solder mask, Flood screen printing, Quality Control.
印制板，阻焊膜，丝网印刷，品质控制。
PCBA conformal coating, dam process, Solder mask coating, DIP Component fixing.
PCBA表面三防涂覆、堤坝工艺、涂防焊胶、DIP元件加固等。
The solder mask is configured on the dielectric layer and covers the circuit layer.
焊罩层配置在介电层上且覆盖线路层。
Is the viscosity of the solder mask after preparation checked to ensure the quality?
在检验前是否测试防焊的粘性以确保品质？
Areas that should not be soldered to may be covered with a polymer solder resist (solder mask) coating.
区域，不应该被焊接到可以覆盖着一层焊抵抗焊接罩聚合物涂料。
Screen Print: Solder mask coating will cover completely the panel holes, pads and traces, on both sides.
网印：在板两面完全涂覆阻焊油墨，包括导通孔、焊盘。
The text on the two solder mask layer is same, we will cancel the text that on this solder mask layer, please refer to Q9.
此层上的字符与另一层绿油上的字元相同，请确认是否可以取消此层上的该字符。请看Q9处。
The text on the solder mask layer is overlapping the text that on the circuit layer. We suggest move it away. Please refer to Q7.
绿油层上的字符与线路上的字符重叠在一起，建议将绿油层上的字符移开。请看Q7处。
The circuit board comprises a dielectric layer, a circuit layer and at least one electricity-conducting joint pole and a solder mask.
一种电路板，其包括介电层、线路层、至少一导电接合柱与焊罩层。
Please see below picture, those letters overlap at circuit layer and solder mask. We suggest deleting the letters in solder mask layer.
如图，那些字在线路和阻焊层都有，我们建议删除阻焊上的字。
The execution of the liquid photoimageable solder mask of the printed circuit board was briefly introduced. The process and its quality control were also illuminated.
本文对印制板液态感光成形阻焊剂的制作进行了简单介绍，对该制程的工艺过程和品质控制进行了较为详细的论述。
The manufacture of liquid photosensitive solder mask for PCB by screen printing is briefly introduced. The process and its quality control are also discussed in detail.
对印制板采用丝网印刷液态感光成形阻焊剂的制作进行了简单介绍，并对该制作工艺和品质控制进行了较为详细的论述。
The solder mask layer is formed on the flexible dielectric layer to locally cover the pins and to cover or expose the reinforced metal patterns according to different application.
该防焊层形成于该可挠性介电层上，以局部覆盖该些引脚，并依不同应用可覆盖或显露该补强金属图案。
A semiconductor package substrate for preventing deformation mainly comprises a flexible dielectric layer, a plurality of pins, at least one reinforced metal pattern and a solder mask layer.
一种改善变形的半导体封装基板，主要包括一可挠性介电层、多数个引脚、至少一补强金属图案以及一防焊层。
In addition, the solder mask coating on printed circuit board, with the plasma treatment, can also obtain certain roughness and high active surface, thus improving the solder coating adhesion.
另外，在阻焊膜涂覆前，用等离子体对印制电路板面处理一下，还可获得一定的粗糙度和高活性的表面，从而提高阻焊膜层的附着力。
Resist: coating material used to mask or to protect selected areas of a pattern from the action of an etchant solder or plating.
阻剂：用来选择性保护某图形区域免受蚀刻剂，焊料或电镀影响的涂层材料。
Resist: coating material used to mask or to protect selected areas of a pattern from the action of an etchant solder or plating.
阻剂：用来选择性保护某图形区域免受蚀刻剂，焊料或电镀影响的涂层材料。
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