Sulfate tin plating process has been widely used in electroplating industry for its strengths such as high current efficiency, fast plating rate, low cost and easy effluent disposal.
硫酸盐光亮镀锡工艺具有电流效率高、沉积速度快、成本低及废水易处理等优点，在电镀生产中已广泛应用。
The mechanism of electroless tin plating was discussed.
对化学镀锡的机理做了探讨。
Pretreatment, silver plating, nickel plating and tin plating of chip components.
应用于片式元器件的前处理、镀银、镀镍、镀锡等工艺。
The invention relates to a piston ring and a surface spongy tin plating technique thereof.
一种活塞环及其表面松孔镀锡工艺。
The research tendency and developing prospect of electroless tin plating are also discussed.
同时对化学镀锡的研究方向和发展趋势进行展望。
The process of electroless tin plating has wide applications in microelectronic filed.
化学镀锡工艺在微电子行业具有很好的应用前景。
Operating hints and safety requirement of re melting in crystal pattern tin plating were introduced.
介绍了晶纹镀锡中重熔工序的操作要点和安全要求。
Describes the process, operating hints for crystal-tin plating and stripping of the defective films.
阐述冰花镀锡的工艺流程、要点，以及不良镀层的退除。
It can be used for electroless tin plating on copper substrate in electronic element, surface mounting device and PCB.
结果表明 ：该工艺镀液稳定 ，可用于电子元器件以及表面安装器件、印制电路板等铜基上化学镀锡。
The process formula and flow of BH-411 bright sulfate tin plating, maintenance and management of the bath were introduced.
介绍了BH-411光亮硫酸镀锡的工艺配方、工艺流程和镀液的维护与管理，讨论了镀液中的硫酸、硫酸亚锡和添加剂的作用。
In order to further improve the properties of tin electrodeposits, a multifunctional sulfate tin plating additive was developed.
为进一步提高镀锡层的性能，研制出一种多功能硫酸盐镀锡添加剂。
The effects of the composition and controlled conditions of electroless tin plating on the morphology of coatings are investigated.
研究了化学镀锡溶液组成和工艺条件对镀层表面形貌的影响。
Main technical requirements of pure tin plating bath common used for electronic component and device electroplating were introduced.
介绍了目前常用于电子元器件电镀纯锡液的主要技术要求。
Causes for the hydrogen embrittlement during alkaline tin plating of elastic articles were discussed, preventive and remedial measures were presented.
探讨了弹性零件碱性镀锡产生氢脆的原因并提出了预防及消除措施。
The invention comprises the following procedures: preplating, etching, chromium plating, washing, removal of hydrogen, hole loosing, washing and drying and tin plating treatment.
本发明包括镀前工序、刻蚀工序、镀铬工序、水洗工序、除氢工序、松孔工序、水洗烘干工序、镀锡处理工序。
Summarizes continuous plating processes for electronic connector assemblies including gold, palladium and, tin plating solutions, properties of the films, and continuous plating equipment.
综述了接插件连续镀金、钯、锡的电镀工艺，包括设备、镀液和镀层性质。
Author made selection and experiment for brighteners and stabilizers which are used for acidic bright tin plating. More ideal brightener and stabilizer are obtained through the experiments.
作者对酸性光亮镀锡的光亮剂及稳定剂进行了选择，并作了试验，获得了较为理想的光亮剂和稳定剂。
PLATIVE ISP3023, a kind of insulated protective paint, is specialized applied to general plating treatment, or acid pickling, such as nickel plating, copper plating, chrome plating, tin plating, etc.
PLATIVE ISP3023是一种耐酸蚀绝缘保护油墨，专门开发应用于电镀一般金属的阻镀保护作用，或者酸蚀加工抗蚀保护作用，如镀镍、镀铜、镀铬、镀锡等；
Tin Plating on Solder Tail, Harpoon: Brass.
电镀锡焊尾，鱼叉：黄铜。
Tin plating: Immediately after copper plating, a thin layer(0003") of tin is electroplated on the surface of the copper. Tin will act as an etch resist in a future manufacturing process."
镀锡：镀铜后在铜表面再镀上一层锡，大约3mil厚，在下工序中起到抗蚀保护线路的作用。
Tin plating: Immediately after copper plating, a thin layer(0003") of tin is electroplated on the surface of the copper. Tin will act as an etch resist in a future manufacturing process."
镀锡：镀铜后在铜表面再镀上一层锡，大约3mil厚，在下工序中起到抗蚀保护线路的作用。
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