尺寸小型化与功率高密度化是当今电子封装器件两大主要发展趋势。
The two trends in the electronics packaging component field nowadays are the miniaturization in the size and high intensity in power.
利用统计分析手段，对高功率二极管激光器封装中各工艺环节引起器件失效的原因进行了分析和归类。
Using statistics analysis method, diode laser failure states were classified and the causes of these diode laser failures were analyzed in every packaging process.
目前，封装行业对器件热载荷可靠性做了大量研究工作，而对功率载荷的研究很有限。
At present, the packaging industry has done plenty of works to the reliability in thermal load while the study of power load is very less.
目前，封装行业对器件热载荷可靠性做了大量研究工作，而对功率载荷的研究很有限。
At present, the packaging industry has done plenty of works to the reliability in thermal load while the study of power load is very less.
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